Die Attachment by Extremely Fast Pressure-Assisted Sintering of 200 nm Cu Particles

Kim, Myeong In; Lee, Jong‐Hyun

doi:10.1007/s13391-021-00277-w

Cited by 9 publications

(1 citation statement)

References 24 publications

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“…Sintering of Cu nanoparticles has an oxidation issue and this could reduce the joint reliability [5]. Cu nanoparticles have been widely studied as a die attach interconnection material due to their comparable conductivity to Ag but high abundance and electro-chemical migration resistance [6][7][8][9][10][11]. Acid pre-treatment followed by inert gas sintering is a popular way to remove the original oxide and suppress the oxide formation during the sintering process.…”

Section: Introductionmentioning

confidence: 99%

In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics

Zuo,

Mannan

2023

IMAPSource Proceedings

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This study presents a special in situ reduction-sintering of CuO and Cu nanoparticles. The microstructure and strength of sintered Cu joints by CuO and Cu nanoparticle were compared. The reduced Cu particles of CuO have a larger size of 1 μm and lower sinterability which results in an insufficient sintering of Cu. In contrast, the sintered Cu nanoparticle structure shows a strong bonding of Cu and plastic deformation after fracture. Owing to the removal of the original oxide and limitation of its re-appearing during sintering by the proposed method, high sintered Cu joint strength over 30 MPa was achieved without the need for pressurized sintering or protective gas atmospheres.

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