Die attachment, wire bonding, and encapsulation process in LED packaging: A review

Alim, Md. Abdul; Abdullah, M. Z.; Aziz, Mohd Yusmaidie; Kamarudin, R.

doi:10.1016/j.sna.2021.112817

Cited by 51 publications

(13 citation statements)

References 154 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…73,74 Filler activity in polymer matrices is influenced by the size, shape, distribution, surface area and surface chemistry . 70,[75][76][77][78] Fillers are mostly particulates or short fibre having the size from micro to the nanoscale. The effectiveness of the reinforcing fillers and particles in composites is directly proportional to the filler surface area to volume ratio and inversely proportional to the size of the fillers .…”

Section: Nanofillersmentioning

confidence: 99%

A review investigating the influence of nanofiller addition on the mechanical, thermal and water absorption properties of cellulosic fibre reinforced polymer composite

Amjad

Anjang

Awais

et al. 2021

Journal of Industrial Textiles

View full text Add to dashboard Cite

Composite holds great promise for future materials considering its advantages such as excellent strength, stiffness, lightweight, and cost-effectiveness. Due to rising environmental concerns, the research speed gradually changes from synthetic polymer composites to natural fibre reinforced polymer composites (NFRPCs). Natural fibres are believed a valuable and robust replacement to synthetic silicates and carbon-based fibres, along with biodegradability, recyclability, low cost, and eco-friendliness. But the incompatibility between natural fibre and polymer matrices and higher moisture absorption percentage of natural fibre limitise their applications. To overcome these flaws, surface treatment of natural fibre and nanofiller addition have become some of the most important aspects to improve the performance of NFRPCs. This review article provides the most recent development on the effect of different nanofiller addition and surface treatment on the mechanical, thermal, and wetting behaviour of NFRPCs. It concludes that the fibre surface treatment and nanofillers in natural fibre polymer composites positively affect mechanical, thermal and water absorption properties. A systematic understanding in this field covers advanced research basics to stimulate investigation for fabricating NFRPCs with excellent performance.

show abstract

Section: Nanofillersmentioning

confidence: 99%

A review investigating the influence of nanofiller addition on the mechanical, thermal and water absorption properties of cellulosic fibre reinforced polymer composite

Amjad

Anjang

Awais

et al. 2021

Journal of Industrial Textiles

View full text Add to dashboard Cite

show abstract

“…Microelectronics packaging is an essential part of the microelectronics industry, which is one of the pillar industries in countries all over the world. The common chip interconnect technologies in microelectronic packaging include wire bonding [ 1 , 2 ], flip-chip bonding [ 3 , 4 ], tape automated bonding (TAB) [ 5 , 6 ], etc. Wire bonding has been the most cost-effective, mature, and flexible interconnect technology in microelectronic packaging since its invention in the 1960s, which is still used to assemble more than 80% semiconductor packages in the microelectronic packaging industry [ 7 , 8 ].…”

Section: Introductionmentioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

View full text Add to dashboard Cite

Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

show abstract

“…Wire bonding is the most widely used technology in the electronic packaging industry [ 1 , 2 , 3 ]. Previously, gold wire was the most commonly used material in wire bonding, but with the high price of gold, many alternative materials have been proposed [ 4 , 5 , 6 ]. Currently, the alternative materials with the most potential are copper-based and silver-based wires [ 7 , 8 , 9 , 10 ].…”

Section: Introductionmentioning

confidence: 99%

Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment

2023

View full text Add to dashboard Cite

Chloride ions contained in the sealing compound currently used in the electronic packaging industry not only interact with intermetallic compounds but also have a serious impact on silver alloy wires. A 15 μm ultrafine quaternary silver-palladium-gold-platinum alloy wire was used in this study. The wire and its bonding were immersed in a 60 °C saturated sodium chloride solution (chlorination experiment), and the strength and elongation before and after chlorination were measured. Finally, the fracture surface and cross-section characteristics were observed using a scanning electron microscope and focused ion microscope. The results revealed that chloride ions invade the wire along the grain boundary, and chlorides have been generated inside the cracks to weaken the strength and elongation of the wire. In addition, chloride ions invade the interface of the wire bonding to erode the aluminum substrate after immersing it for enough long time, causing galvanic corrosion, which in turn causes the bonding joint to separate from the aluminum substrate.

show abstract

Die attachment, wire bonding, and encapsulation process in LED packaging: A review

Cited by 51 publications

References 154 publications

A review investigating the influence of nanofiller addition on the mechanical, thermal and water absorption properties of cellulosic fibre reinforced polymer composite

A review investigating the influence of nanofiller addition on the mechanical, thermal and water absorption properties of cellulosic fibre reinforced polymer composite

Research Progress on Bonding Wire for Microelectronic Packaging

Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment

Contact Info

Product

Resources

About