Die Kinetik und der Mechanismus der thermischen Reaktion zwischen Schwefeltetrafluorid und Fluor / The Kinetics and the Mechanism of the Thermal Reaction between Sulfurtetrafluoride and Fluorine

Gonzalez, Alicia Cristina; Schumacher, H. J.

doi:10.1515/znb-1981-1106

Cited by 10 publications

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“…The first of these is suggested by recent theoretical calculations of electron energy distributions in SF 6 /0 2 mixtures by Masek et al [58]. These calculations, however, pertain mainly to gas mixtures containing larger relative 02 content than considered here, and there is reason to doubt that the predicted drop in the SF 6 dissociation rate is sufficient to entirely account for the effect reported here.…”

mentioning

confidence: 63%

“…Moreover, the species SF 4 is reported to be the most stable and most abundant primary product from both thermal dissociation of SF 6 at moderate temperatures [60][61] and from relatively cool electric discharges [20,21,30]. It is known [8] that in the absence of reactive surfaces or gaseous contaminants, the products of SF 6 dissociation rapidly recombine through relatively fast processes such as proposed by Gonzalez and Schumacher [58] to explain the observed thermal conversion of SF 4 +F, into SF 6 . The presence of oxygen, or oxygen containing species in the discharge region can interfere with the recombination process and give rise to the formation of oxyfluorides, free fluorine, and HF.…”

Section: Possible Mechanisms For Oxyfluoride Formationmentioning

confidence: 99%

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Production rates for oxyfluorides SOF2, SO2F2, and SOF4 in SF6 corona discharges

Brunt¹

1985

J. RES. NATL. BUR. STAN.

109

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The most abundant, long-lived stable gaseous species generated by corona discharges in SF 6 gas containing trace levels of 0, and H,0 are the oxyfluorides SOF,, SOF, and SOF 4 . Absolute energy and charge rates-ofproduction of these and the minor products SO,, OCS, and CO2 have been measured at different total gas pressures from 100 kPa to 300 kPa and for discharges of different current, power, and polarity. Oxyfluoride yields for SF6/02 mixtures containing up to 10% 0, have also been measured. The results indicate that oxyfluoride production is not controlled by the concentrations of either 0, or H,0 at levels below about I%, and the rate controlling factor is the dissociation rate of SF 6 in the discharge. The discharge current and time dependence of the production rates are discussed in terms of gas-phase mechanisms that have been proposed to explain previous observations of electrical, thermal, and laser-induced decomposition of SF 6 and SFs/O, mixtures. Upper limits on the total SF 6 decomposition rate in low-current discharges have been estimated. Details of the chemical analysis procedures are given, and application of the results to the design of chemical diagnostics for SF 6 -insulated, high-voltage apparatus is discussed.

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confidence: 63%