Dielectric Gels with Microphase Separation for Wide‐Range and Self‐Damping Pressure Sensing

Abstract

Omnipresent vibrations pose a significant challenge to flexible pressure sensors by inducing unstable output signals and curtailing their operational lifespan. Conventional soft sensing materials possess adequate elasticity but prove inadequate in countering vibrations. Moreover, the utilization of conventional highly‐damping materials for sensing is challenging due to their substantial hysteresis. To tackle this dilemma, dielectric gels with controlled in situ microphase separation have been developed, leveraging the miscibility disparity between copolymers and solvents. The resulting gels exhibit exceptional compression stress, remarkable dielectric constant, and exceptional damping capabilities. Furthermore, flexible pressure sensors based on these microphase‐separated gels show a wide detection range and low detection limit, more importantly, excellent sensing performance on vibrating surfaces. This work offers high potentials for applying flexible pressure sensors in complex practical scenarios and opens up new avenues for applications in soft electronics, biomimetic robots, and intelligent sensing.

Compliant Iontronic Triboelectric Gels with Phase-Locked Structure Enabled by Competitive Hydrogen Bonding

“…No significant ionic liquid leakage was observed within 48 h after the successful gel preparation (Fig. S17), which was attributed to the large number of anions being attracted by the strong hydrogen-bonding donors and being confined in the phase-locked structure [ 49 ], which reduced the water molecule binding sites and ensured the stability of the gels in the practical application environment. In addition, the appearance of the gel becomes slightly cloudy with increasing RC content (Fig.…”

Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction

“…The establishment of reliable interfacial connections between hard materials (such as electrodes) and soft materials (such as biological tissues) is becoming increasingly important. − Adhesion properties and thermal resistance at soft/hard material interfaces have been the most significant bottlenecks for the improvement of interfacial reliability, which are critical for a wide range of applications like electronic packaging, batteries, e-skin, and energy storage, to name a few. − On the one hand, an interface with high adhesion ability can provide enhanced safety and longevity of components and devices, because an interface with the desired adhesion performance can prevent them from failure, due to various stresses during application, such as vibration and bending. , On the other hand, an interface with low interfacial thermal resistance can reduce the interfacial temperature difference − and thus protects the soft/hard interconnects from thermal loads in operation and ensure survivability over the useful life. − Designing soft–hard interfaces with high adhesion performance and low interface thermal resistance is of great significance.…”