Dielectric materials for high‐temperature capacitors

Fan, Botao; Liu, Feihua; Yang, Guang; Li, He; Zhang, Guangzu; Jiang, Shenglin; Wang, Qing

doi:10.1049/iet-nde.2018.0002

Cited by 164 publications

(97 citation statements)

References 126 publications

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“…In either approach, the selection and addition of suitable nanofillers for nanodielectrics are the key steps. In the earlier period of nanodielectric exploration, researchers had high expectations for increasing the dielectric strength via the inclusion of nanofillers . However, many difficulties were encountered and many hidden factors that are associated with filler–polymer interactions have not been resolved.…”

Section: Nanodielectric Materials Explorationmentioning

confidence: 99%

“…Great progresses have been made in capacitors that are made of ferroelectric/dielectric thin films requiring substrates, ceramic thick layers requiring multilayer ceramic‐co‐fired (MLCC), and polymeric dielectric materials requiring free‐standing films. The scope of these researches is very broad and many were reviewed elsewhere already . Therefore, this report does not include thin film subject and MLCC subject.…”

Section: Introductionmentioning

confidence: 99%

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Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors

Tan

2019

Adv Funct Materials

334

166

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The uprising demands for electrical power and electrification requires advanced dielectric functionalities including high capacitance density, high energy density, high current handling capability, high voltage, high temperature, high thermal conductivity, light weight, and environmental reliability. Nanodielectric engineering emerges and attracts extensive efforts from many countries as a result. Unlike prior reviews focusing on lab scale nanocomposite study, this review focuses on recent innovations in polymerbased nanodielectric design on a large scale and their film scale-up efforts for advanced capacitors. The unconventional polymer-nanofiller engineering and their process in the last two decades are discussed. The nanofunctionalized polymers on a molecular level for high dielectric constants and high dielectric strength are briefly described. The challenge associated with film scale-up and retention of nanodielectric properties are then pointed out to be crucial toward a transfer of dielectric and capacitor technology. Several important attempts at scaling up dielectric films and capacitors recently supported by the US government and industry are reviewed. An alternative strategic approach to achieving high performance polymer films is introduced by leveraging 2D surface coating on commercially mature large-scale polymer films. Future pathways for high quality scalable dielectric films exhibiting desirable dielectric properties and feasibility for capacitor manufacturing are suggested.to develop a more compact pulse-forming network for a pulsed high power microwave (HPM), a laser source, aircraft ignition systems, and high-power electrical systems. [1] The US NAVY strove to develop an all-electric warship for advancing its future combat capability (lethality and survivability). This warship required high-power weapons such as electromagnetic railguns for obtaining pin-point accuracy at a very long range electromagnetic launch systems for rapid aircraft and missile deployment and higher-power radar and sonar systems for "seeing" farther through both air and water. The US Army funded the development of the high-energy-density biaxially oriented polypropylene (BOPP) capacitor and the high-temperature polyetherimide dielectric for ground vehicles to realize better serviceability, higher power, and lower mass of the equipment that ground troops carry. [2,3] Although the energy density has been improved up to 3 J cm −3 via metallization control, the performance, and lifetime of BOPP capacitors degrade rapidly with increasing temperature (the ripple current handing capability decreases as the temperature increases from 85 to 105 °C).Improvements in the fault resistance and the reliability of dielectric materials will enable capacitors to withstand higher electrical current and heat without being excessively derated under extreme stress conditions. A large gap remains between the technology availability and the desired properties, such as combined high temperature and energy density and a low dissipation factor. Fa...

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Section: Nanodielectric Materials Explorationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors

Tan

2019

Adv Funct Materials

334

166

View full text Add to dashboard Cite

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“…However, most polymer dielectrics have low operation temperature, and they would lose dielectric stability when work temperature comes near to their glass‐transition temperature ( T g ) . This greatly limits their applications in some emerging fields such as aerospace industry, deep oil drilling, and hybrid electric vehicles, which require the work temperature to exceed 120 °C …”

Section: Introductionmentioning

confidence: 99%

“…5 However, most polymer dielectrics have low operation temperature, and they would lose dielectric stability when work temperature comes near to their glass-transition temperature (T g ). 6,7 This greatly limits their applications in some emerging fields such as aerospace industry, deep oil drilling, and hybrid electric vehicles, which require the work temperature to exceed 120 C. 8 To address this issue, a variety of high-performance engineering plastics with high T g are considered as promising candidates. 6,9,10 Among them, polyimide (PI) has received great attention due to its excellent thermal stability, outstanding electrical insulation and mechanical properties, as well as good film forming characteristic.…”

Section: Introductionmentioning

confidence: 99%

Dielectric properties and energy‐storage performance of two‐dimensional molybdenum disulfide nanosheets/polyimide composite films

Cheng

Wang

Liu

et al. 2019

J of Applied Polymer Sci

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Flexible dielectric materials with high electric energy density and high‐temperature resistant characteristic are of great importance for modern electronics and electrical systems. Herein, two‐dimensional molybdenum disulfide (MoS2) nanosheets were efficiently produced via liquid‐phase exfoliation and then incorporated into polyimide (PI) to prepare MoS2/PI dielectric nanocomposites. Compared to the pristine PI, MoS2/PI nanocomposite films exhibited much larger dielectric permittivity while their dielectric losses still maintained relatively low levels. On the other hand, the Weibull breakdown strength of these nanocomposite films initially increased and then decreased with the increase in the MoS2 content and gave rise to a maximum value of 395 MV m−1 at 1 vol % loading. Combination of the improved dielectric permittivity and breakdown strength makes the MoS2/PI nanocomposite film with 1 vol % MoS2 possess an elevated energy density of about 3.35 J cm−3. Moreover, good tensile and thermal properties of the nanocomposite films hold great promise for their applications in high‐temperature and harsh conditions. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47991.

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“…Recently, engineering polymers with high glass transition temperature (T g ), such as polycarbonate, polyimide (PI), poly(arylene ether nitrile), and poly(ether ketone ketone) have been exploited as high-temperature dielectric materials. 14,[17][18][19][20][21][22][23] Unfortunately, all the polymers suffer considerable energy loss under high electric fields and at elevated temperatures, which is due to the leakage current that increases exponentially with increasing temperature, resulting in sharp drops in both energy density and chargedischarge efficiency of the polymer dielectrics.…”

mentioning

confidence: 99%

Ternary polymer nanocomposites with concurrently enhanced dielectric constant and breakdown strength for high‐temperature electrostatic capacitors

Ren

et al. 2019

InfoMat

Self Cite

133

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The exploration of high‐energy‐density electrostatic capacitors capable of operating both efficiently and reliably at elevated temperatures is of great significance in order to meet advanced power electronic applications. The energy density of a capacitor is strongly dependent on dielectric constant and breakdown strength of a dielectric material. Here, we demonstrate a class of solution‐processable polymer nanocomposites exhibiting a concurrent improvement in dielectric constant and breakdown strength, which typically show a negative correlation in conventional dielectric materials, along with a reduction in dielectric loss. The excellent performance is enabled by the elegant combination of nanostructured barium titanate and boron nitride fillers with complementary functionalities. The ternary polymer nanocomposite with the optimized filler compositions delivers a discharged energy density of 2.92 J cm−3 and a Weibull breakdown strength of 547 MV m−1 at 150°C, which are 83% and 25%, respectively, greater than those of the pristine polymer. The conduction behaviors including interfacial barrier and carrier transport process have been investigated to rationalize the energy storage performance of ternary polymer nanocomposite. This contribution provides a new design paradigm for scalable high‐temperature polymer film capacitors.

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Dielectric materials for high‐temperature capacitors

Cited by 164 publications

References 126 publications

Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors

Review of Polymer‐Based Nanodielectric Exploration and Film Scale‐Up for Advanced Capacitors

Dielectric properties and energy‐storage performance of two‐dimensional molybdenum disulfide nanosheets/polyimide composite films

Ternary polymer nanocomposites with concurrently enhanced dielectric constant and breakdown strength for high‐temperature electrostatic capacitors

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