Dielectric measurements in large frequency and temperature ranges of an aromatic polymer

Diaham, Sombel; Locatelli, Marie-Laure; Lebey, Thierry; Dinculescu, Sorin

doi:10.1051/epjap/2009193

Cited by 20 publications

(15 citation statements)

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“…Dynamic mechanical relaxation measured at 10 Hz gives a peak at −93 °C . in the poly(ether imide) created from 6FDA and p‐ phenylene diamine and corresponds to the process investigated using dielectric relaxation by Diaham et al and indicating an activation energy of 48 kJ mol −1 . A comparable value of 43 kJ mol −1 has been reported for the low temperature relaxation in 3,3′,4,4′‐benzophenone tetracarboxylic dianhydride and diaminophenylindane and observed a coincidence between the dielectric and mechanical relaxation processes indicating a commonality in the processes being observed.…”

Section: Resultssupporting

confidence: 58%

“…Optimization of a material for a particular application requires an understanding of the structure: physical property relationships for that material. Dielectric relaxation is a useful probe of the effects of changes in the polymer structure on the extent to which the materials may undergo morphological change as the temperature is changed and is an important property when selecting materials for electronic applications . Changes to groups, which form the backbone structure, can introduce steric hindrance and both influence the chain mobility and inhibit packing.…”

Section: Introductionmentioning

confidence: 99%

“…and these poly (ether imide)s lack the additional interactions associated with the amide structure . Previous dielectric studies of the higher temperatures characteristics of polyimides are dominated by the effects of ionic migration and in a number of systems have made study of the T g process very difficult. Above 0 °C a significant contribution to the dielectric conductivity without a corresponding change in the dielectric permittivity were observed which precluded analysis of the dielectric data above this temperature.…”

Section: Introductionmentioning

confidence: 99%

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Dielectric relaxation studies of some poly(ether imide)s containing main‐chain ethyleneoxide units

Eastmond

Paprotny

Pawson

et al. 2014

J Polym Sci B Polym Phys

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Broad band dielectric relaxation spectra are reported for some poly(ether imide)s based on 2,2‐bis[4′‐(3″,4″‐dicarboxyphenoxy)phenyl]hexafluoropropane dianhydride and 1,2‐bis(4‐aminophenyl) diamines derived from ethylene glycol oligomers of different specific lengths. Spectra were obtained over the temperature range −150–−20 °C and which covers the low temperature relaxation region for these materials. In the case of the polymer with no EO units, a single broad dipole relaxation feature is observed. The introduction of a single CH2CH2O unit significantly broadens the relaxation suggesting the existence of two separate relaxation processes. Increasing the number of EO units per repeat to 3 and 6, allows resolution of two relaxations processes; one due to an oscillatory–librational motion of the imide segment and the other to conformational changes involving the EO sequences. Analysis of the relaxation using the Havriliak‐Negami equation indicates that both processes deviate for the description of a simple dipole relaxation and indicate cooperativity of bond motion in the relaxation process. The ability of a polymer to change its packing density is reflected in changes in the relaxation spectra on annealing and changes in the value of the higher frequency limiting values of the permittivity. The activation energy for dipole reorientation ranges from a value of 34 kJ mol−1 for the relaxation of the dipole associated with the imide relaxation process to a value of 60 kJ mol−1 for the polymer containing 3 EO segments. In this latter polymer, system a lower activation energy process is observed with a magnitude of ∼15 kJ mol−1 associated with conformational changes of the aliphatic ether. © 2014 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2014, 52, 1326–1336

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Section: Resultssupporting

confidence: 58%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Dielectric relaxation studies of some poly(ether imide)s containing main‐chain ethyleneoxide units

Eastmond

Paprotny

Pawson

et al. 2014

J Polym Sci B Polym Phys

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“…Thermal, electrical and mechanical properties of polymers are useful for use in technological and biological applications [1][2][3][4][5][6][7]. Thin polymer films obtained by plasma polymerization are generally more biocompatible than conventional biomaterials such as Silastic.…”

Section: Introductionmentioning

confidence: 99%

The thickness dependence of dielectric properties in the plasma polymer thin films

Ulutaş

2018

Can. J. Phys.

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In this study, the results of dielectric spectroscopy of plasma polymerized poly(ethylene oxide) thin films are presented. The films were deposited by plasma-assisted physical vapour deposition at radio-frequency plasma discharge power of 5 W, and film thicknesses of 20, 100, and 250 nm. Dielectric measurements of the films were performed in the frequency range of 10−1–107 Hz and temperature was scanned between 173 and 353 K. The dielectric constant ([Formula: see text]) and dielectric loss ([Formula: see text]) of plasma polymerized poly(ethylene oxide) thin films were calculated by measuring capacitance (C) and dielectric loss factor (tanδ). It was observed that there were two relaxation mechanisms in the investigated frequency range. These were called α and β relaxations. These relaxations shift toward higher frequencies with increasing temperature. Moreover, α-relaxation starts to appear at different temperatures. This shows the difference between the polarizability abilities of samples at the same temperature and same frequencies. The reason for this behavior can be expressed by the dead layer concept, which is a result of good adhesion of the bottom layer of plasma polymer to the substrate. In light of these interpretations, with thinner samples it is possible to have structurally similar thin films like thin films deposited at high plasma power. A thinner film may support more transparency and these thinner films may be effective as coverage of optical devices, such as lenses, visors, etc.

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“…However, the high temperature dielectric spectra are often modified by trapping of charge carriers at interfaces within the bulk of the sample (interfacial or Maxwell-Wagner-Sillars (MWS) polarization) as well as at the interface between sample and electrodes (space charge or electrode polarization (EP)). So, it is necessary to use DRS coupled with a physico-analytic model to determine high temperature dc conductivity [3].…”

Section: Introductionmentioning

confidence: 99%

Dielectric relaxation spectroscopy of single- and double-layer polyimide/SiO<inf>2</inf> thin films

Pham¹,

Wei²,

Locatelli³

et al. 2013

2013 IEEE International Conference on Solid Dielectrics (ICSD)

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High temperature dielectric relaxation spectroscopy (DRS) experiments have been performed on MIS (metalinsulator-semiconductor), MOS (metal-oxide-semiconductor) single-layer and MIOS (metal-insulator-oxide-semiconductor) double-layer structures, where I is polyimide (PI) film (10µm), and O is PECVD SiO 2 thin film (1.5 µm-thick), from 200 to 350 °C, in the 10 -1 Hz to 10 6 Hz frequency range. In such a high temperature range and/or at low frequencies, the dielectric spectra are often influenced by interfacial dielectric relaxations such as Maxwell-Wagner-Sillars (MWS) and electrode polarization (EP). The empirical Havriliak-Negami (H-N) model is used to determine the values from the effective ac dielectric response. For single-(PI) and double-layer structures (PI/SiO 2 ), thevaries from 1.1x10 -10 to 5.5x10 -9 Ω -1 cm -1 and from 7x10 -14 to 2.3x10 -12 Ω -1 cm -1 between 250 and 350°C, with an activation energy of the conduction phenomenon of 1.1 and 0.95 eV, respectively. The PI/SiO 2 structure is suited for semiconductor device passivation applications at high temperature up to 300°C.

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Dielectric measurements in large frequency and temperature ranges of an aromatic polymer

Cited by 20 publications

References 53 publications

Dielectric relaxation studies of some poly(ether imide)s containing main‐chain ethyleneoxide units

Dielectric relaxation studies of some poly(ether imide)s containing main‐chain ethyleneoxide units

The thickness dependence of dielectric properties in the plasma polymer thin films

Dielectric relaxation spectroscopy of single- and double-layer polyimide/SiO<inf>2</inf> thin films

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