2005
DOI: 10.1002/marc.200500310
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Dielectric Properties of Polyimide‐Mica Hybrid Films

Abstract: Summary: Polyimide‐mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N‐dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical breakdown strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI‐mica hybrid fi… Show more

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Cited by 52 publications
(22 citation statements)
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“…When the content of OREC is 1 wt%, the dielectric constant of cured BADCy/OREC composites was lower in frequency range of 10 2 −10 6 Hz as compared with pure cured BADCy (Fig. 15a), this phenomena is accordance with the results reported by Refs36 and37. As OREC content increases further, BADCy/OREC composites exhibit higher dielectric constant.…”
Section: Resultssupporting
confidence: 89%
“…When the content of OREC is 1 wt%, the dielectric constant of cured BADCy/OREC composites was lower in frequency range of 10 2 −10 6 Hz as compared with pure cured BADCy (Fig. 15a), this phenomena is accordance with the results reported by Refs36 and37. As OREC content increases further, BADCy/OREC composites exhibit higher dielectric constant.…”
Section: Resultssupporting
confidence: 89%
“…[1][2][3][4][5][6] In electronic packaging, low-k dielectric materials minimize cross talk and maximize signal propagation speed in devices. Aromatic polyimide ͑PI͒ has been widely used as an interlayer dielectric in microelectronic devices, thanks to its good mechanical properties, excellent chemical and thermal stabilities, high breakdown voltage, and low dielectric constant.…”
mentioning
confidence: 99%
“…Aromatic polyimide ͑PI͒ has been widely used as an interlayer dielectric in microelectronic devices, thanks to its good mechanical properties, excellent chemical and thermal stabilities, high breakdown voltage, and low dielectric constant. [1][2][3][4][5][6][7][8] Simpson and St. Clair 3 have summarized the strategies used to lower dielectric constant in polyimides. In particular, fluorine is usually introduced into polyimide in order to further decrease the dielectric constant.…”
mentioning
confidence: 99%
“…However, composites can meet the requirements that their components can not do. Therefore, the researches concern about the design of the structure and property of organic-inorganic composites are gained more and more attention [1,2] .…”
Section: Introductionmentioning
confidence: 99%