Differential bondwire interface for chip-to-chip and chip-to-antenna interconnect above 200 GHz

Hebeler, Joachim; Steinweg, Luca; Zwick, Thomas

doi:10.23919/eumc54642.2022.9924340

Cited by 10 publications

(3 citation statements)

References 8 publications

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“…Using an encapsulation helps push the differential transition's impedance to the targeted 100 Ω. A study on the bond wire dimensions and encapsulant dependency is presented in [6]. The main limitation of this transition is the pad capacitance, as the encapsulant cannot compensate for it.…”

Section: Antenna Constructionmentioning

confidence: 99%

“…These publications focused on single-ended systems due to measurement constraints. In [6], differential bond wire interfaces and packaging concepts are presented, which are also employed for the antenna design presented here. In order to characterize the antenna separately from the interconnect, an on-chip balun and an on-substrate balun are used.…”

Section: Introductionmentioning

confidence: 99%

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Differential Wideband Antenna on Organic Substrate at 240 GHz with a Differential Wirebond Package

Hebeler,

Zwick

2023

PIER Letters

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This letter investigates a differential, planar, and wideband antenna on a commercial organic printed circuit board (PCB) substrate at 240 GHz with a novel packaging concept to integrate massive monolithically integrated circuits (MMICs). The antenna utilizes multiple series resonators to achieve a bandwidth of 75 GHz around 240 GHz. A novel differential bond wire package solution from chip to antenna feeds the differential antenna from an on-chip Marchand balun. The fabrication of the antenna and interconnect are analyzed, and potential improvements for future works are highlighted. Measurement proves the function of the designed package, which is competitive to the state of the art.

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Section: Antenna Constructionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Differential Wideband Antenna on Organic Substrate at 240 GHz with a Differential Wirebond Package

Hebeler,

Zwick

2023

PIER Letters

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“…This paper presents a novel approach to assembling our phased array system. By employing a differential bond wire interconnect [10], we can measure our MMIC separately [11] and connect it to external antennas [12]. While the targeted data rates necessitate a true-time delay architecture, the used MMIC has an LO steering phase shifter.…”

Section: Introductionmentioning

confidence: 99%

Wideband BPSK Transmitter Phased Array Operating at 246 GHz With ±30° Steering Range

Hebeler,

Steinweg,

Ellinger

et al. 2024

IEEE Access

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This paper presents the construction and measurement of a phased array BPSK transmitter system operating at 246 GHz with tested data rates of up to 32 Gbit s =1 . The system is built using custom monolithic microwave integrated circuit (MMIC) and a novel packaging solution. The construction showcases the flexibility in the chosen approach, paving a path for future systems. It is the first TX array with significant beam steering capabilities tested above a pure antenna pattern stage above 200 GHz. The system is tested for realistic usage scenarios. Bit-error-rate (BER) measurements are used to showcase real-world usability. BER over angle and BER over steering angle are measured to verify the operation of the transmitter.

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Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect

Riaz,

Protze,

Hoyer

et al. 2023

2023 21st IEEE Interregional NEWCAS Conference (NEWCAS)

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Differential bondwire interface for chip-to-chip and chip-to-antenna interconnect above 200 GHz

Cited by 10 publications

References 8 publications

Differential Wideband Antenna on Organic Substrate at 240 GHz with a Differential Wirebond Package

Differential Wideband Antenna on Organic Substrate at 240 GHz with a Differential Wirebond Package

Wideband BPSK Transmitter Phased Array Operating at 246 GHz With ±30° Steering Range

Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect

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