Differential wideband interconnects for organic millimeter wave chip packages: An effort to design an all-purpose RF chip package

Rohrl, Franz Xaver; Jakob, Johannes; Bogner, Werner; Hageneder, Daniel; Zorn, Stefan

doi:10.1109/eumic.2016.7777610

Cited by 7 publications

(1 citation statement)

References 6 publications

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“…An RF transmission line such as microstrip can form the travelling-wave electrodes of an electro-optic (EO) modulator and is the key platform for wire bonding, bump bonding, and other packaging techniques [6,7]. Its function is to convey the RF signal from the RF connector to the electrodes of the EO modulator or other EO interconnection devices to achieve the conversion from electric signal to optical signal [8][9][10]. Common methods for interconnecting these two devices are wire bonding or bump bonding [11].…”

Section: Introductionmentioning

confidence: 99%

RF Interconnection Design of Bump Bonding with a Dislocation Package Structure towards Electro-Optic Modulation Applications

Peng,

Wang,

Wang

et al. 2023

Photonics

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Bonding technology can be an important component of packaging for photonic chips, such as electro-optic (EO) modulators and other active function devices. In general, an EO modulator chip can achieve a broader 3 dB EO bandwidth than its packaging device, as the packaging design and structure can technically limit modulation performance. Recently, bump bonding has been shown to be a good candidate for the EO interconnection technique, which has a higher transmission bandwidth than wire bonding. In this article, we propose a design for radio frequency (RF) interconnection of bump bonding with a dislocation packaging (BBDP) structure. Through simulation calculations and analysis, the proposed BBDP structure shows a 3 dB transmission bandwidth of approximately 145 GHz, which is 52.6% better than one using optimized wire-bonding structures (95 GHz). The proposed packaging structure presents an important alternative method for ultrahigh speed optical modulation applications.

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