Differential wideband interconnects for organic millimeter wave chip packages: An effort to design an all-purpose RF chip package

Rohrl, Franz Xaver; Jakob, Johannes; Bogner, Werner; Hageneder, Daniel; Zorn, Stefan

doi:10.1109/eumc.2016.7824631

Cited by 3 publications

(6 citation statements)

References 5 publications

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“…8.Insertion loss of aerosol lines compared with common PCB lines (substrate 1 of Fig. 2: Panasonic Megtron 6 ® , substrate thickness = 100 µm, DK = 3.36@ 40 GHz, DF = 0.01 @ 40 GHz [2]).…”

Section: Electrical Rf Characterization Of Gap Filler Materials and Simentioning

confidence: 99%

“…As chip carriers, the packages well-characterized in [2] were used. The fabricated broadband differential structures allow an analysis of the aerosol transition from DC to 67 GHz.…”

Section: Measured Performance Of Aj Connectionmentioning

confidence: 99%

“…The fabricated broadband differential structures allow an analysis of the aerosol transition from DC to 67 GHz. The measurement setup and the deembedding procedures used are identical to those in [2]. Figure 10 shows the comparison of an AJ and a bond transition.…”

Section: Measured Performance Of Aj Connectionmentioning

confidence: 99%

“…1) reaches its limits. By differential signal routing, a broadband transition between package and chip can be expanded up to 67 GHz [2]. Narrowband transitions in this frequency range are possible.…”

Section: Introductionmentioning

confidence: 99%

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Bare die connections via aerosol jet technology for millimeter wave applications

Rohrl

Jakob

Bogner

et al. 2019

Int. J. Microw. Wireless Technol.

Self Cite

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This paper presents a comparison of chip connections using aerosol jet (AJ) and bond technology on low-cost printed circuit board (PCB) substrates. First, the behavior of the used gap filler material and the used silver ink for AJ technology on PCBs are characterized. In addition to comparing the radio frequency (RF) performance (DC to 67 GHz) of the two technologies, the mechanical stability is also compared. While the AJ technology transitions score above all for their RF performance and the lower requirements (surface finish, pad size, and adhesion) on the PCB, the bonding technology has clear advantages, especially with a different coefficient of thermal expansion values of the substrates to be connected. Finally, the measurement results of a complete package are shown, whereby the chip connection is realized once by means of AJ and once by bonding wires.

show abstract

Section: Electrical Rf Characterization Of Gap Filler Materials and Simentioning

confidence: 99%

“…As chip carriers, the packages well-characterized in [2] were used. The fabricated broadband differential structures allow an analysis of the aerosol transition from DC to 67 GHz.…”

Section: Measured Performance Of Aj Connectionmentioning

confidence: 99%

Section: Measured Performance Of Aj Connectionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Bare die connections via aerosol jet technology for millimeter wave applications

Rohrl

Jakob

Bogner

et al. 2019

Int. J. Microw. Wireless Technol.

Self Cite

View full text Add to dashboard Cite

show abstract

“…Wireless communication and sensing systems are continuously raising new demands not only on performance of components, but also on their miniaturization, integration with on-chip devices, environmental effects, and costs. Planar components are easy to fabricate, result in low-profile circuits, and are therefore cost-efficient [1][2][3][4]. The current design of planar circuits still, however, follows a conventional approach that relies on assemblage of basic building blocks, such as filters, hybrid couplers, and antennas.…”

Section: Introductionmentioning

confidence: 99%

Compact Differential-Fed Planar Filtering Antennas

et al. 2019

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This paper proposes novel low-profile differential-fed planar antennas with embedded sharp frequency selectively. The antennas are compact and easy to integrate with differential devices without matching baluns. The antenna design is formulated as a topology optimization problem, where requirements on impedance bandwidth, directivity, and filtering are used as the design objectives. The optimized antennas operate over the frequency band 6.0–8.5 GHz. The antennas have reflection coefficients below −15 dB, cross-polarization levels below −42 dB, a maximum gain of 6.0 ± 0.5 dB, and a uniform directivity over more than 130° beamwidth angle in the frequency band of interest. In addition, the antennas exhibit sharp roll-off between the operational band and frequencies around the 5.8 GHz WiFi band and the 10 GHz X-band. One antenna has been fabricated with a good match between simulation and measurement results.

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Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts

Yin,

Yang,

et al. 2024

Electronics

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Currently, the high-speed performance of thin-film lithium niobate electro-optic modulator chips is evolving rapidly. Nevertheless, due to the inherent technical limitations imposed by the packaging design and material architecture, the intrinsic electro-optic bandwidth of thin-film lithium niobate electro-optic modulator chips often exceeds the bandwidth of their packaging interfaces, which can constrain the realization of modulation performance. Bump bonding emerges as a high-bandwidth EO interconnection technology, outperforming wire bonding for faster optical communication. In this paper, we present a high-speed thin-film lithium niobate modulator chip tailored for concave–convex bonding, alongside an analysis and design of the chip’s flip-chip bonding packaging. By exploiting the superior electrical characteristics of concave–convex bonding, we effectively mitigate the radio frequency losses of modulator chip and packaging. The simulated half-wave voltage (Vπ) of 3.5 V and E-O modulation bandwidth greater than 150 GHz is obtained for a 0.5 cm long modulator after flip-chip bonding packaging.

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Differential wideband interconnects for organic millimeter wave chip packages: An effort to design an all-purpose RF chip package

Cited by 3 publications

References 5 publications

Bare die connections via aerosol jet technology for millimeter wave applications

Bare die connections via aerosol jet technology for millimeter wave applications

Compact Differential-Fed Planar Filtering Antennas

Design of High-Speed Thin-Film Lithium Niobate Modulator Utilizing Flip-Chip Bonding with Bump Contacts

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