Diffusion bondability of similar/dissimilar light metal sheets

Ziegelheim, J.; Hiraki, Shunsuke; Ohsawa, Hiroaki

doi:10.1016/j.jmatprotec.2006.12.020

Cited by 21 publications

(9 citation statements)

References 3 publications

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“…8 c . During the processing of diffusion welding, the application of pressure and elevated temperatures makes the two surfaces bond together, 14 and activate the diffusional motion at the interface. As for rolling, coalescence of metals by the external pressure, mechanical work, and plastic deformations applied on the interface zone.…”

Section: Resultsmentioning

confidence: 99%

Interfacial characteristics of Cu–Fe laminate fabricated by solid state welding

Yang

Lin

Chen

et al. 2014

Materials Science and Technology

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Solid state welding was employed to join low intersolubility metal couple Cu–Fe, and the microstructure and mechanical properties of the joints were investigated. The interface was free of defects. Scanning electron microscopy, energy dispersive spectrometry, atomic force microscopy and nanoindentation results revealed that a potential area of pseudo-binary alloy was present at the faying surface, where nanoscale particles were moved to the opposite side by facilitated diffusion. Owing to the mechanism of microcontact and facilitated diffusion, the interfacial strength was improved.

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Section: Resultsmentioning

confidence: 99%

Interfacial characteristics of Cu–Fe laminate fabricated by solid state welding

Yang

Lin

Chen

et al. 2014

Materials Science and Technology

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“…During the processing of SSB, the application of elevated temperatures and plastic deformation makes the two intended bonding surface together [28], which is realized by the movement of atoms across the interface via interaction force transmitted from outside. Due to the film hypothesis by S. B. Ainbinder et al, all metals and alloys possess an equal property to seize when clean surfaces are brought together within the range of interatomic forces [29].…”

Section: Microstructure Of Mo/cu Interfacementioning

confidence: 99%

Interface of Mo–Cu laminated composites by solid-state bonding

Wang

Chen

Yang

et al. 2015

International Journal of Refractory Metals and Hard Materials

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“…Generally, direct diffusion bonding of dissimilar materials is a challenging task due to the following reasons [11][12][13]:…”

Section: Introductionmentioning

confidence: 99%

“…Generally, direct diffusion bonding of dissimilar materials is a challenging task due to the following reasons [11-13]: Mismatch in the coefficient of thermal expansions (CTE) of dissimilar materials might result in the development of high residual stresses and poor mechanical properties of the joints; Difference in intrinsic diffusion coefficients of alloying elements might lead to formation of micro-voids and micro-cracks at the bonding interface, i.e. known as Kirkendall effect; Formation of hard and brittle intermetallic compounds at the joint interface is a common problem when diffusion bonding dissimilar materials. …”

Section: Introductionmentioning

confidence: 99%

Diffusion bonding of copper alloy to nickel-based superalloy: effect of heat treatment on the microstructure and mechanical properties of the joints

Zhang

Shirzadi

2021

Science and Technology of Welding and Joining

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Diffusion bonding of copper alloy to nickel-based superalloy: effect of heat treatment on the microstructure and mechanical properties of the jointsSuccessful joining of heat conducting materials, such as copper, to high-temperature components is of significant importance for heat management in nuclear power plants and liquid propellant launch vehicles. However, it is impossible to fusion weld copper alloys to stainless steels or nickel superalloys (GH4169) using conventional welding processes. Therefore, solid-state processes, such as friction welding or diffusion bonding, are considered for joining such un-weldable dissimilar materials. Diffusion bonding of a copper alloy (C18150) to a Ni-based superalloy (GH4169) was investigated in this work. The bonding trials at 900℃ for 60 minutes under a constant 10 MPa pressure led to formation of sound joints free from intermetallic, pores, voids and discontinuities. Conventional tensile testing led to the failure within the copper alloy and away from the joint (i.e. fully cohesive failure) in all samples. Due to the softening of the copper alloy during the bonding process, the maximum tensile strength of the as-bonded copper alloy was only 48 % of its as-received strength. Post-bonding solution treatment at 960℃ for 60min followed by ageing at 450 ℃ for 3.5 h, restored the tensile strength of the copper alloy up to 77%. The microstructures of the diffusion bonded samples in the as-bonded and after the hardening heat treatment were also investigated.

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Diffusion bondability of similar/dissimilar light metal sheets

Cited by 21 publications

References 3 publications

Interfacial characteristics of Cu–Fe laminate fabricated by solid state welding

Interfacial characteristics of Cu–Fe laminate fabricated by solid state welding

Interface of Mo–Cu laminated composites by solid-state bonding

Diffusion bonding of copper alloy to nickel-based superalloy: effect of heat treatment on the microstructure and mechanical properties of the joints

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