1999
DOI: 10.1115/1.2818499
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Diffusion Bonding of CMSX-4 to UDIMET 720 Using PVD-Coated Interfaces and HIP

Abstract: There is an increasing interest in development of manufacturing methods for Dual Property BLISKs, consisting of creep resistant airfoils and fatigue resistant disks bonded together by a durable joint. Optimum heat treatments are, however, very different for creep resistant single crystal CMSX-4 and fatigue resistant polycrystalline Udimet 720 selected in this study, but fortunately the first aging treatment for CMSX-4 (1140°C, 2–6 h, AC) is similar to the partial solution treatment of U 720 HS2 (115°C, 4h, OQ)… Show more

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Cited by 5 publications
(4 citation statements)
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“…Summaries of these estimations are given in Table 6. Fatigue testing work indicates that the fatigue limit of 23-8N is significantly lower than the nickel based Comparison of the limited data generated for these materials by rotating beam fatigue methods to that determined by Eaton Corp. in a similar manner [37] indicates that fatigue limits for the present estimations deviate a maximum of 4% from a logarithmic interpolation of the Eaton data. Fracture surfaces were not analyzed in detail for these tests.…”
Section: Elevated Temperature Fatigue Propertiesmentioning
confidence: 89%
“…Summaries of these estimations are given in Table 6. Fatigue testing work indicates that the fatigue limit of 23-8N is significantly lower than the nickel based Comparison of the limited data generated for these materials by rotating beam fatigue methods to that determined by Eaton Corp. in a similar manner [37] indicates that fatigue limits for the present estimations deviate a maximum of 4% from a logarithmic interpolation of the Eaton data. Fracture surfaces were not analyzed in detail for these tests.…”
Section: Elevated Temperature Fatigue Propertiesmentioning
confidence: 89%
“…1. The MC forming elements Ti, Ta, and Nb 10,11 are locally accumulated in the precipitates. Elements such as Mo and W were also found, but the partitioning to the precipitates is much lower than for Ti, Ta and Nb.…”
Section: Microstructure Investigationmentioning
confidence: 99%
“…2. Other types of carbides/borides, such as M 23 (C,B) 6 (rich in Cr), M 3 B 2 (rich in Cr, Mo and some W, Ti), MB 2 (rich in Cr and some W, Mo) 10 and M 6 C (rich in Mo, W) 11,12 seem to be unlikely because they contain Cr, which was totally absent in the filmlike precipitates.…”
Section: Microstructure Investigationmentioning
confidence: 99%
“…A HIP bonding strength with minimal penalties in mechanical properties highly relies on the alloy compositions, HIP cycle, post heat treatment, and interface preparation for cleanliness before HIP, which govern the resulting composition and phases, grain structure, and residual stress at bonding interface. Solid-to-solid HIP diffusion bonding requires low surface roughness, high cleanliness, and oxide-free bonding interface ensured by a physical or chemical interface preparation method prior to HIP [3,22]. The HIP temperature and post-HIP heat treatment shall be carefully balanced to reduce interface voids and prevent severe grain coarsening.…”
Section: Introductionmentioning
confidence: 99%