2013
DOI: 10.1080/09507116.2012.753311
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Diffusion bonding through interlayers

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Cited by 15 publications
(6 citation statements)
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“…The joining surfaces of the specimens were surface prepared by standard techniques using few steps of grinding papers and polished on 1 µm diamond suspension. The copper foil of 150 µm thickness was used as an intermediate metal [5,6]. There were cut square profiles from the copper foil having 50 mm thickness.…”
Section: Methodsmentioning
confidence: 99%
“…The joining surfaces of the specimens were surface prepared by standard techniques using few steps of grinding papers and polished on 1 µm diamond suspension. The copper foil of 150 µm thickness was used as an intermediate metal [5,6]. There were cut square profiles from the copper foil having 50 mm thickness.…”
Section: Methodsmentioning
confidence: 99%
“…It depends on many factors such as purity, surface roughness and chemical composition of all materials involved, method of deposition and thickness of interlayer. The relative thickness and ductile properties of the interlayer material influence the stress-strain state at the bond interface and the contact effect such as hardening/softening [74]. Depending on the type of material used for bonding, interlayers can be classified by their purpose:…”
Section: (Ii) Use Of Interlayers and Effect Of Alloying Elementsmentioning
confidence: 99%
“…To bond the materials with higher hardness and brittleness, it is necessary to use interlayer activators of the bonded surfaces, which have higher ductility compared to those of parent metal. Depending on the interlayers' purpose, they are implemented in the form of foils, films and coatings, deposited on one or both bonding surfaces by electroplating or vacuum spraying, rolling of powders or combining the spraying and foil [74].…”
Section: (Ii) Use Of Interlayers and Effect Of Alloying Elementsmentioning
confidence: 99%
“…Interlayers are used in diffusion bonding to reduce chemical heterogeneity and thermodynamic instability in the transition zone of the joint, as well as to prevent or restrict the effects of temperature deformation considerably while joining dissimilar metals. The interdiffusion that occurs between the interlayer and the base metal makes the TLP bonding technique effective for joining dissimilar metals with a large difference in thermal properties. …”
Section: Introductionmentioning
confidence: 99%