Diffusion coefficient of copper, tin and copper tin alloy

Abstract

Abstract. Pseudopotential formalism is used to construct an ionic effective potential (ion-ion potential screened by electrons). Molecular Dynamics is used in conjunction with the constructed effective potential to get the atomic structure factor of the pure components copper and tin which are compared to the experimental ones. We selected the Shaw Optimized Model Potential having proved that it adequately describes the atomic structure, we used it to calculate the velocity autocorrelation function and to deduce the self diffusion of pure metals: copper, tin and the diffusion coefficient of copper in the Sn 95,6% Cu 4,4% .

Fast Diffusion and Void Formation in a Two-Segment Copper-Tin Lead-Free Nanowire System with One-Dimensional Confinement

“…With an increase of the e-beam exposure time, tin was activated and reached the quasi-melting/melting state. The melting rate was much faster than the diffusion rate, 19 and thus most of tin diffused into the Cu-rich region along the axial direction under the tin oxide layer confinement and formed intermetallic compounds. Under further intensive e-beam irradiation, the Cu/Sn alloy particles were formed and distributed on the amorphous oxide shell and then reorganized to form larger particles with better crystalline structure.…”