Diffusion-elastic phenomena in nickel and cobalt electrodeposits plated on to strip cathodes

Armyanov, S.; Sotirova, G.

doi:10.1016/0257-8972(88)90099-0

Cited by 17 publications

(9 citation statements)

References 9 publications

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“…The absolute value of the compressive stress decreases after the current is switched off and remains constant at a value of -4.8 kg/mm*, i.e., the currentless change of the stress h~* = 1.1 kg/mm 2. The reason for the appearance of postplating tensile stress is the evolution of hydrogen which has been codeposited in the coatings (16,17,40).…”

Section: Methodsmentioning

confidence: 99%

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The Internal Stress in Ni, NiFe , CoFe , and CoNi Layers Measured by the Bent Strip Method

Sotirova‐Chakarova

Armyanov

1990

J. Electrochem. Soc.

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The physical meaning and formulas for the calculation of the different, but interrelated, types of the internal stress (IS) in thin films (instantaneous, residual, and average) are reviewed. These formulas are then applied to the cases of plated Ni and NiFe, CoFe, and CoNi alloys. The IS profiles (the IS distribution through the film thickness) are given for all cases. The relationship between the IS and the structure parameter (phase composite, crystallite size, and microstain) changes with alloy composition is discussed.) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.210.126.199 Downloaded on 2015-04-13 to IP

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Section: Methodsmentioning

confidence: 99%

“…The IS is measured for nickel and binary alloys of metals from the iron group, using the bent strip method (1), and the relationships between the IS and structure are determined. The use of the dilatometric method for the IS measurement has been published previously (14)(15)(16)(17).…”

mentioning

confidence: 99%

The Internal Stress in Ni, NiFe , CoFe , and CoNi Layers Measured by the Bent Strip Method

Sotirova‐Chakarova

Armyanov

1990

J. Electrochem. Soc.

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“…Where C H (t) is the concentration of hydrogen that diffuses in or out of the film, Ω is the atomic volume of the film material, ΔΩ is the change in atomic volume with hydrogen, M f is the reduced elastic modulus, and Δσ f (t) is the change in stress due to absorption or desorption. [ 37,42 ] The observed increase in tensile stress of 38 MPa in the Cu–Bi system after 4 h would correspond to ≈0.6 at% hydrogen desorption. We used an electrochemical quartz crystal microbalance (eQCM) and calculated the metal plating charge efficiency to be ≈93%, which suggests side reactions and impurity co‐deposition are possible (See Note S3, Supporting Information).…”

Section: Resultsmentioning

confidence: 99%

Understanding and Improving Mechanical Stability in Electrodeposited Cu and Bi for Dynamic Windows Based on Reversible Metal Electrodeposition

McAndrews

Yeang

Cai

et al. 2022

Advanced Energy Materials

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Zn) to dynamic glazings with applications for thermal emissivity (e.g., Ag) or windows (e.g., Cu, Bi, Ag, and Zn). In each of these systems, a layer of metal is electroplated for the system's designed purpose: energy storage for batteries, [1][2][3][4] infrared light modulation for dynamic thermal emissivity, [5] and visible light modulation for dynamic windows. [6][7][8] The mechanical stability of the electrodeposited films is paramount for the devices' durability in practical applications. Mechanical failure can occur in the form of detached dendrites, "dead" metal, pits, and cracked or delaminated films, which usually result in loss of active material leading to device failure. The mechanics of electrodeposited Li has been extensively studied for Li metal batteries. [9,10] Dynamic windows allow for electronic and user control over light and

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“…During the experiments, the surface stress caused compressive stress in the layer [14]. The diffusion of hydrogen into the Ni grain boundaries causes the lattice to expand and become linked to the compressive stress [15]. Similar to the effect of hydrogen, other impurities such as carbon, sulphur and oxygen can induce compressive stress when they are incorporated into the Ni grain boundaries [16].…”

Section: Analysis Of Experimental and Theoretical Resultsmentioning

confidence: 99%

Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process

Zhao

2015

Micro & Nano Letters

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Many micrometal devices are fabricated by microelectroforming technology in microelectromechanical systems. Micrometal devices usually suffer from poor interfacial adhesion strength, which restricts the application of microelectroforming technology. To solve this problem, in this reported work the influence of the electroforming crystallite size on practical adhesion energy is investigated. Furthermore, based on the energy balance criterion of fracture mechanics, the Miedema model of experimental electron theory (Miedema model) and the surface stress model, the equations between the crystallite size and the practical adhesion energy are established originally. Concerning the equations, the results show that the practical adhesion energy keeps an increasing trend and approaches basic adhesion energy as the crystallite size increases. To prove the equations, microelectroforming experiments were performed. The practical adhesion energy was measured by a scratch test. The crystallite size of the electroforming layer was tested by X-ray diffraction technology. The results of the experiments show that, within the range of the crystallite size, the practical adhesion energy keeps an increasing trend and approaches 15 J/m 2. The theoretical and the experimental results show the same trend. The equations are verified by the experiments and this work may guide the microelectroforming process.

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Diffusion-elastic phenomena in nickel and cobalt electrodeposits plated on to strip cathodes

Cited by 17 publications

References 9 publications

The Internal Stress in Ni, NiFe , CoFe , and CoNi Layers Measured by the Bent Strip Method

The Internal Stress in Ni, NiFe , CoFe , and CoNi Layers Measured by the Bent Strip Method

Understanding and Improving Mechanical Stability in Electrodeposited Cu and Bi for Dynamic Windows Based on Reversible Metal Electrodeposition

Quantitative relationship between crystallite size and adhesion strength of the electroforming layer during microelectroforming process

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