Diffusion of iron, nickel and cobalt in aluminum

Hirano, Ken‐ichi; Agarwala, R.P.; Cohen, Morris

doi:10.1016/0001-6160(62)90100-1

Cited by 129 publications

(37 citation statements)

References 8 publications

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“…It shows that the solubility of Ni in the Al lattice is negligible, whereas Al is considerably soluble in Ni with a solubility limit of 9 at % at 450 • C under equilibrium condition. Taking into account that the activation energy for the diffusion of Ni in Al (Q (Ni → Al) ≈ 66 kJ/mol [43]) is lower than the activation energy of Al in Ni (Q (Al → Ni) ≈ 90 kJ/mol [44]) at 450 • C, it is logical to assume that the diffusion distance of Ni in Al is larger than vice versa, and given the limited solubility of Ni in the Al lattice it would imply that the first intermetallic phase appears at the Ni/Al interface (cf. Figure 2) on the side of the Al layer, and at the Ni side of the interface a solid solution of Al in Ni should exist.…”

Section: Phase Formation Mechanism: Phase Evolution During the Fabricmentioning

confidence: 99%

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

Azimi

Toroghinejad

Shamanian

et al. 2017

Metals

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Abstract:In the present work, the influence of strain on phase formation at the Al/Ni interface was investigated during cold roll bonding and annealing. A sandwich sample composed of an Al-Ni-Al stack was cold rolled with reductions in the range of 50% to 90%, followed by annealing at 450 • C for 60 min. The crystallography of the annealed sandwich samples was analyzed by XRD (X-ray diffraction), whereas the microstructure was studied by scanning electron microscopy, equipped with EDS (energy dispersive spectrometer) analysis, and optical microscope. In the annealed samples, the intermetallic phase Al 3 Ni has formed at the Ni/Al interface, preferentially on the Al side of the interface. It is found that the applied strains did not have an effect on the type of intermetallic phase that was formed. However, the rolling reduction has a significant effect on the morphology of the intermetallic layer, as it was observed that after the lowest reduction of 50% only some scattered intermetallic nuclei were present, whereas at the highest rolling reduction of 90% a continuous intermetallic layer of 4.1 µm was exhibited. The formation of the intermetallic layer is discussed in terms of Al and Ni diffusion at the interface and irregular nature of the Al/Ni bonded interface after rolling reductions.

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Section: Phase Formation Mechanism: Phase Evolution During the Fabricmentioning

confidence: 99%

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

Azimi

Toroghinejad

Shamanian

et al. 2017

Metals

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“….For comparison, we note that the diffusion coefficient of Ni in solid AI has been reported as 10-11 cm 2 /sec at 580°C [9].…”

Section: Optical Resultsmentioning

confidence: 89%

Role of nickel in Al-10 percent Si composites containing nickel-coated sapphire whiskers

Yakowitz¹,

Jenkins²,

Hahn³

1968

J. RES. NATL. BUR. STAN. SECT. A.

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Th e role of ni c kel in regard to whj s ke r· matrix bo ndin g in a co mpos ite of ni c ke l-coated sap phire wh is ke rs inserted into a matrix of aluminum-lO percent sili con al loy by mea ns of liquid phase hotpress ing wa s investi gated. Th e s tud y was ca rri e d out with th e aid o f o pti ca l and e lectron mi c rosco py , e lectron probe m ic roa nalys is, and mi c rohardn ess meas ure ments . Res ults s how th at mos t of th e ni c ke l is di s tributed within the matrix alloy.So me of the ni c ke l appar e nt ly int e rac ts with the matr ix and fo rm s NiAb. Th e prese nce of NiAl3 in thi s form incr eases the average hardn ess of the co mposite but. apparently does not co ntribute s ignifi ca ntly to s tre ngth e nin g of the alloy . Occasionally, c lus te r s or c lumps of ni c ke l-ri c h ma t.e ri a l whic h a lso cont.ains a luminum a re found at or very nea r whi s ker-matr ix interfa ces. It is co nc lud e d that if any bondin g of the ni c ke l to the sa pphire occ urred , it was in th ese regio ns. F inall y, a heat treatment to improve nic ke l to sa pphire bonding a nd hence bondin g of t.h e e ntire compos ite is s ugges ted .Key Word s: AI-IO pe rce nt Si alloy , e lectron prob e mi croa naiyze r, fib e r co mpos ite, matrixwh is ke r bondin g, Ni coated sapphire whi s ke rs, optical me tallograp hy, sapp hire whi ske rs.

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“…where [76], respectively. If we assume the surface diffusivity for Ni or Co in Al is also five orders of magnitude higher than its bulk diffusivity, similar to that for Sn, As illustrated in Figure 9(c), σ d decreases with decreasing sample size, showing a 'smaller is weaker' trend, and the strength due to displacive plasticity, sum , calculated using Equation (9) increases with decreasing sample size, showing a 'smaller is stronger' trend.…”

Section: Hybrid Diffusive-displacive Plasticitymentioning

confidence: 99%

Bridging room-temperature and high-temperature plasticity in decagonal Al–Ni–Co quasicrystals by micro-thermomechanical testing

Zou

Wheeler

Sologubenko

et al. 2016

Philosophical Magazine

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(2016) Bridging room-temperature and high-temperature plasticity in decagonal Al-Ni-Co quasicrystals by micro-thermomechanical testing, Philosophical Magazine, 96:32-34, 3356-3378, DOI: 10.1080/14786435.2016 Ever since quasicrystals were first discovered, they have been found to possess many unusual and useful properties. A long-standing problem, however, significantly impedes their practical usage: steadystate plastic deformation has only been found at high temperatures or under confining hydrostatic pressures. At low and intermediate temperatures, they are very brittle, suffer from low ductility and formability and, consequently, their deformation mechanisms are still not clear. Here, we systematically study the deformation behaviour of decagonal Al-Ni-Co quasicrystals using a micro-thermomechanical technique over a range of temperatures (25-500 °C), strain rates and sample sizes accompanying microstructural analysis. We demonstrate three temperature regimes for the quasicrystal plasticity: at room temperature, cracking controls deformation; at 100-300 °C, dislocation activities control the plastic deformation exhibiting serrated flows and a constant flow stress; at 400-500 °C, diffusion enhances the plasticity showing homogenous deformation. The micrometersized quasicrystals exhibit both high strengths of ~2.5-3.5 GPa and enhanced ductility of over 15% strains between 100 and 500 °C. This study improves understanding of quasicrystal plasticity in their lowand intermediate-temperature regimes, which was poorly understood before, and sheds light on their applications as small-sized structural materials.

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Diffusion of iron, nickel and cobalt in aluminum

Cited by 129 publications

References 8 publications

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

Role of nickel in Al-10 percent Si composites containing nickel-coated sapphire whiskers

Bridging room-temperature and high-temperature plasticity in decagonal Al–Ni–Co quasicrystals by micro-thermomechanical testing

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