2014
DOI: 10.1088/1748-0221/9/01/c01007
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Digital column readout architectures for hybrid pixel detector readout chips

Abstract: In this paper, two digital column architectures suitable for sparse readout of data from a pixel matrix in trigger-less applications are presented. Each architecture reads out a pixel matrix of 256 x 256 pixels with a pixel pitch of 55 μm. The first architecture has been implemented in the Timepix3 chip, and this is presented together with initial measurements. Simulation results and measured data are compared. The second architecture has been designed for Velopix, a readout chip planned for the LHCb VELO… Show more

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Cited by 13 publications
(14 citation statements)
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“…Digital circuitry for in-pixel processing becomes a more prominent part in the pixel in terms of area and transistor count. This trend is also visible in pixel readout chips developed as a spin-off for other applications [65][66][67][68][69][70][71][72][73] like photon counting: TABLE II. lists several readout chips, the ones intended for high energy physics (white background) all use enclosed layout except ClicPix_demo [77] where the 65 nm technology provides sufficient radiation tolerance without it, the one for other applications (gray background) do not use enclosed layout except Eiger [72] [73].…”
Section: B Front-end Readout Chipsmentioning
confidence: 87%
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“…Digital circuitry for in-pixel processing becomes a more prominent part in the pixel in terms of area and transistor count. This trend is also visible in pixel readout chips developed as a spin-off for other applications [65][66][67][68][69][70][71][72][73] like photon counting: TABLE II. lists several readout chips, the ones intended for high energy physics (white background) all use enclosed layout except ClicPix_demo [77] where the 65 nm technology provides sufficient radiation tolerance without it, the one for other applications (gray background) do not use enclosed layout except Eiger [72] [73].…”
Section: B Front-end Readout Chipsmentioning
confidence: 87%
“…In the newly developed timepix3 chip (Fig. 13) [69] [70], capable of operating with a wide range of gaseous and silicon detectors, the analog part occupies only 25 % of the pixel. It contains a 256 × 256 square pixel-array with 55 µm pitch.…”
Section: B Front-end Readout Chipsmentioning
confidence: 99%
“…However, this method has the disadvantage of high-power consumption, both from distributing the readout clock signal to every register and from clocking at high frequency. This method can be modified to allow a frame-based zerosuppressed readout by adding logic which skips a pixel with no data, and adds a 'flag' which identifies the position of the skipped pixels [15].…”
Section: Pixel Detector Readout Techniquesmentioning
confidence: 99%
“…Several methods such as data node based, network based or a combination of these architectures [16,17] can be used to move packet based, zero-suppressed data from the shift register at one end of the column or matrix to the periphery at the opposite end of the ROIC, and subsequently off-chip. The data are essentially moved from the shift register in one pixel to another, possibly with additional registers per group of pixels to alleviate congestion.…”
Section: Pixel Detector Readout Techniquesmentioning
confidence: 99%
“…The detector has 256x256 pixels with a pixel pitch of 55 μm. It allows the acquisition of time and energy information for each incident photon by simultaneously measuring the time-of-arrival (ToA) and time-over-threshold (ToT) of each X-ray photon [36]. The electronics of the Timepix3 chip can be bump bonded to diverse sensor materials such as Si, CdTe, CdZnTe, Ge, or GaAs.…”
mentioning
confidence: 99%