Digital Pixel Test Structures implemented in a 65 nm CMOS process

Rinella, G. Aglieri; Andronic, A.; Antonelli, M.; Aresti, Mauro; Baccomi, Roberto; Becht, Pascal; Beolè, S.; Braach, Justus; Buckland, Matthew Daniel; Buschmann, E.; Camerini, P.; Carnesecchi, F.; Cecconi, Leonardo; Charbon, Edoardo; Contin, G.; Dannheim, D.; Mélo, João de; Deng, Wei; Mauro, Antonello di; Hasenbichler, Jan Anton; Hillemanns, H.; Hong, Geun Hee; Isakov, Artem; Junique, Antoine Jean-Simon; Kluge, A.; Kotliarov, Artem; Lautner, Lukas; Mager, M.; Marras, D.; Martinengo, P.; Masciocchi, S.; Menzel, Marius Wilm; Münker, Magdalena; Piro, Francesco; Rashevski, Sasha; Rebane, Karoliina; Reidt, F.; Russo, Roberto; Sanna, Isabella; Sarritzu, Valerio; Senyukov, S.; Snoeys, W.; Sonneveld, J.; Šuljić, M.; Švihra, Peter; Tiltmann, Nicolas; Usai, G. L.; Beelen, Jacob Bastiaan Van; Vassilev, Mirella Dimitrova; Vernieri, C.; Villani, Anna

doi:10.48550/arxiv.2212.08621

Cited by 7 publications

(9 citation statements)

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“…ITS3: A truly cylindrical inner tracker for ALICE Jory Sonneveld for the ALICE Collaboration wafer-scale chip is expected at the end of 2024. Characterization of many small prototypes from a first prototype run on a multi-layer reticle proved operation at room temperature of 20 • C of a digital pixel test structure to be 100% efficient after being irradiated with the ITS3 expected fluence and dose, and operable at 99% efficiency after a fluence of 100 times that of Φ eq = 10 15 1 MeV n eq /cm 2 [9], as shown in Fig. 7.…”

Section: Pos(hardprobes2023)077mentioning

confidence: 96%

ITS3: A truly cylindrical inner tracker for ALICE

Sonneveld

2024

Proceedings of 11th International Conference on Hard and Elecctromagnetic Probes of High-Energy Nuclear Collisions — PoS(HardPr

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After the successful installation and first operation of the new Inner Tracking System (ITS2), which consists of about 10 m 2 of monolithic silicon pixel sensors, ALICE is pioneering the usage of bent, wafer-scale pixel sensors for the ITS3 for Run 4 at the LHC in 2029. Sensors larger than typical reticle sizes can be produced using the technique of stitching. At thicknesses of about 30 𝜇m, the silicon is flexible enough to be bent to radii of the order of 1 cm. By cooling such sensors with a forced air flow, it becomes possible to construct a detector with minimal material budget. The reduction of the material budget and the improved pointing resolution will allow new measurements, in particular of heavy-flavor decays and electromagnetic probes. Mechanical studies have shown the sensors to be unaffected by bending, and bent sensors have been shown to be fully efficient in test beams. New sensor developments for the ITS3 have shown promising results for fluences even beyond those expected for ITS3.

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Section: Pos(hardprobes2023)077mentioning

confidence: 96%

ITS3: A truly cylindrical inner tracker for ALICE

Sonneveld

2024

Proceedings of 11th International Conference on Hard and Elecctromagnetic Probes of High-Energy Nuclear Collisions — PoS(HardPr

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“…Secondly, a 65 nm CMOS technology process has been verified for the ITS3 application by the developing and qualifying analog and digital test structures. The design parameters and operational range that keeps the detection efficiency above 99 % and the fake-hit rate below 0.01 pixel −1 s −1 have been identified [3]. In addition, the technology has been verified in terms of radiation hardness.…”

Section: Air-coolingmentioning

confidence: 99%

ALICE ITS3: a bent stitched MAPS-based vertex detector

Groettvik

2024

J. Inst.

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The ALICE ITS3 is a novel vertex detector replacing the innermost layers of ITS2 during LS3. Composed of three truly cylindrical layers of wafer-sized 65 nm stitched Monolithic Active Pixel Sensors, ITS3 provides high-resolution tracking of charged particles generated in heavy-ion collisions. This contribution presents an overview of the ITS3 detector, highlighting its design features, integration and cooling, and the ongoing development towards the final sensor. Furthermore, the paper introduces the off-detector service electronics, which play an essential role in the readout, control, and power supply of the detector.

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“…The DPTS features a 32 × 32 pixel matrix with a pitch of 15 µm implemented in the modified-with-gap process and contains a full digital front-end with asynchronous readout [7]. The sensor is controlled by a set of external reference currents and voltages and read out via a current mode logic (CML) output [8,9].…”

Section: Digital Pixel Test Structurementioning

confidence: 99%

First measurements with monolithic active pixel test structures produced in a 65 nm CMOS process

Buckland

2024

J. Inst.

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The Inner Tracking System (ITS) of the ALICE experiment at CERN will undergo an upgrade during the LHC long shutdown 3, in which the three innermost tracking layers will be replaced. This upgrade, named the Inner Tracking System 3 (ITS3), employs stitched wafer-scale Monolithic Active Pixel Sensors fabricated in a 65 nm CMOS process. The sensors are 260 mm in length and thinned to less than 50 μm then bent to form truly half-cylindrical half-barrels. The feasibility of this process for the ITS3 was explored with the first test production run (MLR1) in 2021, whose goal was to evaluate the charged particle detection efficiency and the sensor performance under non-ionising and ionising radiation up to the expected levels for ALICE ITS3 of 1013 1 MeV neq cm-2 (NIEL) and 10 kGy (TID). Three sensor flavours were produced to investigate this process: Analog Pixel Test Structure (APTS), Circuit Exploratoire 65 (CE65) and Digital Pixel Test Structure (DPTS). This contribution gives an overview of the MLR1 submission and test results, describing the different sensor flavours and presenting the results of the performance measurements done with particle beams for various chip variants and irradiation levels.

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Digital Pixel Test Structures implemented in a 65 nm CMOS process

Cited by 7 publications

References 0 publications

ITS3: A truly cylindrical inner tracker for ALICE

ITS3: A truly cylindrical inner tracker for ALICE

ALICE ITS3: a bent stitched MAPS-based vertex detector

First measurements with monolithic active pixel test structures produced in a 65 nm CMOS process

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