Abstract:The use of eutectic Sn-Cu alloys in packaging applications in microelectronics industry is not something entirely new. However, this alloy was mostly used in large features and fabricated using metal powders and metallurgical deposition techniques. The diameter of an individual grain of the eutectic Sn-Cu powder is typically similar in size to the diameter of pillars or bumps currently used in 3D stacking, and if we were to check its usefulness as a solder on this scale, an alternative manufacturing technique … Show more
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