1993
DOI: 10.1016/0924-4247(93)85008-4
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DIMES-01, a baseline BIFET process for smart sensor experimentation

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Cited by 40 publications
(4 citation statements)
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“…This combines the advantages of a thick membrane in the surface of bulk micromachining, with the easy photolithography and onechip pressure reference of surface micromachining. A bipolar electronic process (DIMES-01 [8]) was chosen, as it is robust and relatively insensitive to ionizing radiation, compared to CMOS processes, so no shielding is necessary. The same epitaxially grown membrane is also used to provide some thermal insulation between the thermal flow sensor and the substrate.…”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…This combines the advantages of a thick membrane in the surface of bulk micromachining, with the easy photolithography and onechip pressure reference of surface micromachining. A bipolar electronic process (DIMES-01 [8]) was chosen, as it is robust and relatively insensitive to ionizing radiation, compared to CMOS processes, so no shielding is necessary. The same epitaxially grown membrane is also used to provide some thermal insulation between the thermal flow sensor and the substrate.…”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…This combines the advantages of a thick membrane in the surface of bulk micromachining, with the easy photolithography and one chip pressure reference of surface micromachining. A bipolar electronic process (DIMES-01 [8]) was chosen, as it is robust and relatively insensitive to ionising radiation, compared to CMOS processes, so no shielding is necessary. The same epitaxially grown membrane is also used to provide some thermal insulation between the thermal flow sensor and the substrate.…”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…Once it has been established that the micromachined structures are to be integrated with the electronics it is necessary to establish the process limitations and whether additions to the standard process are to be permitted. The devices can be integrated with CMOS [11,12] or bipolar electronics [13]. It is important to establish a strategy in terms of how and when in the process the additional steps required for the micromachining can be inserted into the standard process.…”
Section: Introductionmentioning
confidence: 99%