Dip coating of charged colloidal suspensions onto substrates with patterned wettability: Coating regime maps

Reynolds, Timothy D.; Kalpathy, Sreeram K.; Kumar, Satish; Francis, Lorraine F.

doi:10.1016/j.jcis.2010.08.028

Cited by 15 publications

(10 citation statements)

References 39 publications

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“…Figure 12.8 shows this accumulation of particles during the second evaporation stage. This was also observed in previous publications for the system silica particles and silicon wafer, when the attraction between particles and substrate was weakened by electrostatics (Reynolds et al, 2010). Particles were distributed fairly homogeneously in the drop, and only a few particles accumulated close to the contact line due to the internal flow caused by the enhanced evaporation flux at the contact line, as described by Deegan et al (1997).…”

Section: Soft Substrates 163supporting

confidence: 84%

Soft Substrates

Lopes¹

2015

Droplet Wetting and Evaporation

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Section: Soft Substrates 163supporting

confidence: 84%

Soft Substrates

Lopes¹

2015

Droplet Wetting and Evaporation

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“…This was also observed for the system silica particles and silicon wafer, when the attraction between particles and the substrate was weakened by electrostatic charges. 38 In contrast, for so substrates, particles or agglomerates of particles were deposited during contact line retraction. We suggest that two parameters were responsible for the deposition of the particles on the soer substrate: the contact angle of the droplet and the contact line velocity.…”

Section: Deposition Patternmentioning

confidence: 99%

Influence of substrate elasticity on particle deposition patterns from evaporating water–silica suspension droplets

Lopes

Bonaccurso

2013

Soft Matter

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We investigated the evaporation of sessile droplets of water-silica suspensions on deformable polydimethylsiloxane substrates with Young's moduli ranging from 0.2 to 1.5 MPa. We show that substrate elasticity can be employed to control the evaporation patterns and reduce the so-called coffee-staining. The presented method, unlike previously investigated methods, requires no modification of the liquid or the particles. The ratio between deposit height in the center and at the rim of the patternwhich is an important characterizing parameter of a coffee staindecreases with decreasing Young's modulus. This is due to the smaller receding contact angle and the higher contact line velocity of a droplet on a softer substrate. These experimental findings are reproduced by a model for the contact line speed that considers capillary forces, viscoelastic dissipation, and contact line friction.

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“…Details from the manufacturer reveal that the dispersion is composed of 20 nm individual particles in open clusters with a median aggregate diameter of 150 nm. The dispersion shear thins slightly, with an average viscosity of $5 mPa s as reported in experimental measurements elsewhere [41]. The solvent evaporates after coating and the dried films are imaged with an optical microscope.…”

Section: Wire-wound Rod Coatingmentioning

confidence: 85%