Direct Adhesion of EPDM to Aluminum Plate During Peroxide Curing Using Molecular Adhesives

Abstract

The direct adhesion of EPDM compound to Al plate during peroxide curing on the bases of the molecular adhesive method has been investigated. The treatment of Al plate with the ethanol solution of molecular adhesives, 6-(3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-dithiol (TES) gave the TES-linked Al plates by the following three processes such as a immersion process of Al plate in the solution, an adsorption process of TES to OH groups on Al plate, and a linking process between TES and Al plate. The direct adhesion of EPDM compound to Al plate by these processes indicated a significant effect on the peel strength, because they induce the formation of interfacial bond between EPDM compound and TES-linked Al plate. Ingredients in EPDM compound had also an important influence on the formation of interfacial bond, it means thiol groups on the linked-TES did not react directly with EPDM molecular chains in the presence of dicumyl peroxide (DCP). In the EPDM compounds, ingredients such as DCP and m-phenylene bismaleimide (m-BMI) were essential for the direct adhesion of EPDM to TES-linked Al plate. The Al/EPDM adherends obtained had good heat resistance at 120 but decreased the peel strength with aging time at 95 in water. The poor water resistance is estimated to be dependant for the corrosion of Al plate.

Fluid Molecular Bonding of Aluminium Plates & EPDM

“…From this perspective, the key requirement in bonding involving organic materials is to introduce chemical bonds into the bonding interface layer [2,3,7,8]. In joining metal and rubber [9][10][11], however, the only method of bonding, superior even in mechanical terms, for producing interfacial chemical bonds preferentially in the interface layer and so introducing an elastic deformation component and plastic deformation component, is surely molecular bonding technology. Although molecular bonding technol ogy uses a molecular bonding agent [8] to generate chemical bonds at the interface, the formation of interfacial chemical bonds during surface to surface contact is placed in the same category [8].…”