Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics

Ren, Ping; Dong, Jingyan

doi:10.1002/admt.202100280

Cited by 33 publications

(25 citation statements)

References 47 publications

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“…Ren et al used low-melting-point metal ink, Field's Metal (32.5% Bismuth, 51% Indium, 16.5% Tin), to print vertical interconnect accesses (VIAs) using the electrohydrodynamic printing technology to form vertical interconnects. [147] A two-layer circuit overlapped over the same area was interconnected by the printed VIAs and was connected to a battery to light a LED as shown in (Figure 8h). The circuit remained conductive even when the device was bent, stretched, and twisted.…”

Section: Interconnectsmentioning

confidence: 99%

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High‐Resolution 3D Printing for Electronics

et al. 2022

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The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high‐resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D‐printable functional materials and processes for various device components. The latest advances in 3D‐printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next‐generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.

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Section: Interconnectsmentioning

confidence: 99%

mentioning

confidence: 99%

High‐Resolution 3D Printing for Electronics

et al. 2022

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“…The development of tactile-sensing systems is affected by a large number of challenges and constraints [ 56 , 60 ]. One of these regards the fabrication of vertical vias in multi-layered tactile devices, in which functional devices from different layers need to be connected by vertical interconnects [ 61 ]. Some works addressed the problem by manually creating vertical feedthrough (creating holes and metallizing them), during or even after device fabrication [ 62 , 63 ].…”

Section: Requirements and Challenges In Tactile Sensor Designmentioning

confidence: 99%

“…Finally, a major challenge is the possibility of a direct printing of sensors on the target surfaces by exploiting the state of the art of robotic technologies. The problem of vias fabrication is critical, especially in multilayered tactile devices, in which functional devices from different layers need to be connected together by vertical interconnects [ 61 ].…”

Section: Open Problemsmentioning

confidence: 99%

An Atlas for the Inkjet Printing of Large-Area Tactile Sensors

Baldini

Albini²,

Maiolino³

et al. 2022

Sensors

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This review aims to discuss the inkjet printing technique as a fabrication method for the development of large-area tactile sensors. The paper focuses on the manufacturing techniques and various system-level sensor design aspects related to the inkjet manufacturing processes. The goal is to assess how printed electronics simplify the fabrication process of tactile sensors with respect to conventional fabrication methods and how these contribute to overcoming the difficulties arising in the development of tactile sensors for real robot applications. To this aim, a comparative analysis among different inkjet printing technologies and processes is performed, including a quantitative analysis of the design parameters, such as the costs, processing times, sensor layout, and general system-level constraints. The goal of the survey is to provide a complete map of the state of the art of inkjet printing, focusing on the most effective topics for the implementation of large-area tactile sensors and a view of the most relevant open problems that should be addressed to improve the effectiveness of these processes.

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“…However, the surface tension of the liquid metal must be overcome when injecting liquid metal into the channels of the template, which brings difficulty to the manufacturing of multilayer stretchable electronics. Ren et al [22] provided a method of printing liquid metal interconnection wires to efficiently manufacture multilayer devices. The manufacturing process requires strict temperature control and the combined action of air pressure and electric field.…”

mentioning

confidence: 99%

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Sun

Zhang

Zhu

et al. 2022

Adv Materials Technologies

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Multilayer circuits, especially in stretchable electronic devices, are considered to be an effective way to integrate various components and modules for complex functions. However, the existing manufacturing methods for multilayer flexible and stretchable electronics have problems such as complex technology, expensive equipment, and low production efficiency. Here, a direct ink writing 3D printing method is proposed to fabricate multilayer stretchable electronic devices by using high‐viscosity stretchable silver paste as the material for interconnecting wires, and stretchable polydimethylsiloxane as the dielectric layer. The optimal range of printing parameters is explored to realize the stable and repeatable manufacturing of wires. A protective layer is printed on the interconnection wires and rigid components to connect the soft substrate and the rigid electronic components. The results show that stress concentration is reduced and stable electrical response of the device is achieved under more than 49% tensile deformation. Vertical interconnect accesses and arc‐shaped wires are applied to a multilayer flexible thermal imaging display device and a NE555 timer device, and the outcomes prove that the direct ink writing 3D printing method provides an efficient, simple, and low‐cost manufacturing method for fabricating multilayer stretchable electronics.

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Direct Fabrication of VIA Interconnects by Electrohydrodynamic Printing for Multi‐Layer 3D Flexible and Stretchable Electronics

Cited by 33 publications

References 47 publications

High‐Resolution 3D Printing for Electronics

High‐Resolution 3D Printing for Electronics

An Atlas for the Inkjet Printing of Large-Area Tactile Sensors

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

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