2015
DOI: 10.1038/srep10748
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Direct growth of freestanding GaN on C-face SiC by HVPE

Abstract: In this work, high quality GaN crystal was successfully grown on C-face 6H-SiC by HVPE using a two steps growth process. Due to the small interaction stress between the GaN and the SiC substrate, the GaN was self-separated from the SiC substrate even with a small thickness of about 100 μm. Moreover, the SiC substrate was excellent without damage after the whole process so that it can be repeatedly used in the GaN growth. Hot phosphoric acid etching (at 240 °C for 30 min) was employed to identify the polarity o… Show more

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Cited by 53 publications
(38 citation statements)
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“…Thus, the in-plane direction of GaN was dependent on the in-plane direction of SiC substrate, and not dependent on the direction of the periodic nanostructures and laser scanning. The relationship of in-plane direction of GaN and SiC is in agreement with the results reported by other groups [21][22][23].…”
Section: Selective Gan Growthsupporting
confidence: 82%
“…Thus, the in-plane direction of GaN was dependent on the in-plane direction of SiC substrate, and not dependent on the direction of the periodic nanostructures and laser scanning. The relationship of in-plane direction of GaN and SiC is in agreement with the results reported by other groups [21][22][23].…”
Section: Selective Gan Growthsupporting
confidence: 82%
“…13 Region 3 is characterized by the predominance of the CL peak with the maximum at 3.42 eV which is attributed to the band edge emission of the hexagonal phase GaN. 41 The spectral distribution of UV cathodoluminescence in region 2 is similar to that inherent to region 1 ( Figure S4), although, according to the results presented in Figures 5 and 7, the integral intensity of CL in region 2(2 in cross-sectional view) is lower than in region 1(1 ). It is worth noting that, along with the band edge CL peak at 3.42 eV, the region 3(3 ) exhibits a much stronger yellow emission at around 2 eV, see Figures 5b-5e and Figures 7f-7h,7j-7l.…”
Section: Ecs Journal Of Solid State Science and Technology 5 (5) P21mentioning
confidence: 99%
“…In order to increase the thermal conductivity of polymeric materials, carbon based conductive fillers such as carbon nanotubes (CNTs), carbon black, graphite, graphene, and carbon fibers are commonly utilized owing to their oxidation resistance and easy formation of conductive networks, and lightweight properties [4]. Moreover 1D CNTs, 2D graphene, and graphite nanoplatelets have attracted a significant attention during the past decade owing to their high intrinsic thermal conductivities thus facilitating the formation of efficient heat conducting networks within the polymer matrix [5].…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the thermal stability and flammability of polymer can be improved with the incorporation of GNP into polypropylene (PP) [11]. However in-plane alignment of GNP in thin thermal interface material layers suppresses the through-plane heat transport, which limits the GNP performance in the geometry normally required for thermal management applications [5,12]. In literature, hybrid filler formulations were used due to synergistic enhancement of the through-plane thermal conductivity of GNP with conventional low aspect ratio aluminum (Al) and aluminum oxide (Al 2 O 3 ) micro-particle fillers [5,[13][14][15].…”
Section: Introductionmentioning
confidence: 99%
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