Direct metal to metal bonding method for heterogenous 3D integration

Chua, Shen Lin

doi:10.32657/10356/143627

DOI: 10.32657/10356/143627

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Direct metal to metal bonding method for heterogenous 3D integration

Shen Lin Chua¹

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Wafer‐Scale Integration

Safari¹,

Vaisband²

2022

Wiley Encyclopedia of Electrical and Electronics Engineering

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The key challenges of on‐chip integration, including limited scalability, high cost, difficulty to maintain profitable yield, and increased thermal management complexity, suggest that additional avenues for scaling should be explored. Wafer‐scale integration is the extension of the system‐on‐chip approach to ultralarge systems. A comprehensive review of this transition from the standpoint of packaging, thermal management, and system integration is presented in this article. The benefits and challenges of wafer‐scale integration are discussed. Silicon interconnect fabric, a promising platform for high‐performance heterogeneous wafer‐scale integration, is introduced.

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Wafer‐Scale Integration

Safari¹,

Vaisband²

2022

Wiley Encyclopedia of Electrical and Electronics Engineering

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show abstract

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Direct metal to metal bonding method for heterogenous 3D integration

Cited by 1 publication

References 30 publications

Wafer‐Scale Integration

Wafer‐Scale Integration

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