“…Thereafter, TEM in situ straining became popular for clarification of the dislocation dynamics in various materials with face-centered cubic (fcc) [ 6 , 9 , 10 , 11 ], body-centered cubic (bcc) [ 12 , 13 , 14 ], and hexagonal close-packed structures [ 15 , 16 ] during plastic deformation at various temperatures. For brittle fracture, Ikuhara et al [ 17 ] developed a TEM indentation holder working at elevated temperatures and reported the crack propagation by intra- and intergranular fracture in polycrystalline alumina at 1073 K. This indentation technique has been applied to several ceramic materials with brittle nature, such as magnesium oxide, silicon nitride, and sapphire (α-Al 2 O 3 ) [ 18 , 19 , 20 , 21 ]. To clearly visualize the dislocations introduced during TEM in situ indentation experiments, Kondo et al [ 22 , 23 ] recently used a double-tilt indentation holder and characterized an individual dislocation in a SrTiO 3 single crystal and well-oriented SrTiO 3 bicrystals with Σ5 and small-angle grain boundaries.…”