Direct On-Chip 3-D Aerosol Jet Printing With High Reliability

Lan, Xiao; Lu, Xuejun; Chen, Maggie Yihong; Scherrer, D.; Chung, Thomas; Nguyen, Evan; Lai, R.; Tice, Jesse

doi:10.1109/tcpmt.2017.2710957

Cited by 14 publications

(12 citation statements)

References 8 publications

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“…Complementary to the processing speed, is also the efficiency of material usage as the material is only printed where required. This material usage is much lower compared to other manufacturing techniques ( Lan et al, 2017 ).…”

Section: Resultsmentioning

confidence: 85%

Digitally Driven Aerosol Jet Printing to Enable Customisable Neuronal Guidance

Capel

Smith

Taccola

et al. 2021

Front. Cell Dev. Biol.

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Digitally driven manufacturing technologies such as aerosol jet printing (AJP) can make a significant contribution to enabling new capabilities in the field of tissue engineering disease modeling and drug screening. AJP is an emerging non-contact and mask-less printing process which has distinct advantages over other patterning technologies as it offers versatile, high-resolution, direct-write deposition of a variety of materials on planar and non-planar surfaces. This research demonstrates the ability of AJP to print digitally controlled patterns that influence neuronal guidance. These consist of patterned poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS) tracks on both glass and poly(potassium 3-sulfopropyl methacrylate) (PKSPMA) coated glass surfaces, promoting selective adhesion of SH-SY5Y neuroblastoma cells. The cell attractive patterns had a maximum height ≥0.2 μm, width and half height ≥15 μm, Ra = 3.5 nm, and RMS = 4.1. The developed biocompatible PEDOT:PSS ink was shown to promote adhesion, growth and differentiation of SH-SY5Y neuronal cells. SH-SY5Y cells cultured directly onto these features exhibited increased nuclei and neuronal alignment on both substrates. In addition, the cell adhesion to the substrate was selective when cultured onto the PKSPMA surfaces resulting in a highly organized neural pattern. This demonstrated the ability to rapidly and flexibly realize intricate and accurate cell patterns by a computer controlled process.

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Section: Resultsmentioning

confidence: 85%

Digitally Driven Aerosol Jet Printing to Enable Customisable Neuronal Guidance

Capel

Smith

Taccola

et al. 2021

Front. Cell Dev. Biol.

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“…Interconnect parasitic losses can quickly add up to degrade the overall system performance. Therefore, it is critical to have near-bulk metal conductivity, while maintaining reliable conductivity over temperature and environmental excursions [13,93,103,104]. While there are many different techniques that have been investigated for interconnects in DW processes, the current best performers are AJP and wire mesh embedding.…”

Section: Printed Transmission Lines and Interconnectsmentioning

confidence: 99%

“…Achieving these bulk-like material properties will enable a wide application space, but at present, unfortunately there are several limits on which precursor materials are available to print and how well these functionally printed materials perform. Reliability is also a concern as these printed parts could potentially see extreme environments such as aerospace [13]. To this end, it becomes increasingly critical to understand the systemic effects of and controlling both the nano-and microstructures and topology of printed materials while expanding the "toolbox" of materials to print.…”

Section: Introductionmentioning

confidence: 99%

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Rosker

Sandhu

Hester

et al. 2018

International Journal of Antennas and Propagation

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Printing methods such as additive manufacturing (AM) and direct writing (DW) for radio frequency (RF) components including antennas, filters, transmission lines, and interconnects have recently garnered much attention due to the ease of use, efficiency, and low-cost benefits of the AM/DW tools readily available. The quality and performance of these printed components often do not align with their simulated counterparts due to losses associated with the base materials, surface roughness, and print resolution. These drawbacks preclude the community from realizing printed low loss RF components comparable to those fabricated with traditional subtractive manufacturing techniques. This review discusses the challenges facing low loss RF components, which has mostly been material limited by the robustness of the metal and the availability of AM-compatible dielectrics. We summarize the effective printing methods, review ink formulation, and the postprint processing steps necessary for targeted RF properties. We then detail the structure-property relationships critical to obtaining enhanced conductivities necessary for printed RF passive components. Finally, we give examples of demonstrations for various types of printed RF components and provide an outlook on future areas of research that will require multidisciplinary teams from chemists to RF system designers to fully realize the potential for printed RF components.

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“…[11,12] Uniquely, these tools use both pneumatic and ultrasonic atomization to generate a fine mist (i.e., <5 μm droplet diameter) from precursor inks and digitally pattern them through a highly collimated beam. Accordingly, this technology has been used to pattern conductive tracks for a wide range of applications, including strain sensing, [13][14][15] on-chip interconnects for electronic packaging, [16][17][18] and printed transistors, [19,20] for increased densification of electronic subsystems and their incorporation into nonplanar form factors.…”

Section: Introductionmentioning

confidence: 99%

Electroplating of Aerosol Jet‐Printed Silver Inks

et al. 2021

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Aerosol jet printing of silver inks is a promising approach for 3D printing of electronics, particularly for obtaining very complex circuits with high‐resolution conductive pads and traces. Common silver inks are however not competitive with traditional bulk metal conductors, requiring sintering at high temperatures as well as having significant porosity that can result in early failure. Herein, the possibility of using electroplating to deposit bulk metal copper on aerosol jetted inks is investigated, and more than an order of magnitude reduction in electrical resistivity is shown. The plating rate, resistivity, and adhesion are characterized, along with the morphology of the resulting deposits. This approach is then shown to allow high‐strength soldering to the electroplated metal traces, demonstrating the capability of this technology for integration of soldered surface mount components with aerosol jet‐printed electronics.

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Direct On-Chip 3-D Aerosol Jet Printing With High Reliability

Cited by 14 publications

References 8 publications

Digitally Driven Aerosol Jet Printing to Enable Customisable Neuronal Guidance

Digitally Driven Aerosol Jet Printing to Enable Customisable Neuronal Guidance

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Electroplating of Aerosol Jet‐Printed Silver Inks

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