junction quality, thus increasing open circuit voltage (V oc ) and fill factor (FF). It has also been observed that KF-PDT allows a steeper Ga gradient [8] and a thinner CdS buffer layer [6,8] to be employed without having a negative impact on device performance; therefore, the short circuit current (J sc ) can be improved after optimizing Ga gradient and CdS thickness.Though the improvement in device parameters has been generally observed, the underlying mechanism of KF-PDT is still unclear. One possible reason for the improved junction quality is the formation of a Cu-depleted surface layer, which may enlarge the surface bandgap [9] and promote the in-diffusion of Cd [6] during buffer layer deposition. However, the formation of a Cu-depleted surface does not seem to be always observed. For example, Mansfield et al. have claimed that no Cudepleted surface formed on the selenized CIGS after KF-PDT. [10] Another interesting observation is the reduction of Na content in CIGS after KF-PDT, nevertheless the consequences of which have not yet been discussed in literature. Further investigation is still required to fully understand the effects of KF-PDT.The research into CIGS deposited by three-stage coevaporation or two-step processes (metal deposition and postselenization) continues to advance in the pursuit of mass production and low-cost processing. In addition, various fabrication processes of CIGS thin films have been demonstrated and continue to be developed, for example, fabrication from electrodeposited [11] or nanoparticle-based [12] precursor layers. In these processes, however, selenization is indispensable. The need for a postselenization process inevitably increases production costs. Some researchers have attempted to eliminate this unfavorable and time-consuming process. For example, in a hydrazine-based process, device-quality CIGS absorbers were obtained by annealing the spin-coated precursors in an inert atmosphere, yielding cell efficiency of over 15%. [13] One of the key factors of eliminating selenization in the hydrazine-based process is that extra Se can be added into the precursor ink so extra Se in the atmosphere is not required during annealing. [14] However, the main disadvantage of the hydrazine-based process is its toxicity and instability.Directly sputtering from a single CIGS target is another promising process that could produce efficient CIGS absorbers Direct sputtering of a single quaternary Cu(In,Ga)Se 2 (CIGS) target without postselenization is a promising approach to fabricating CIGS absorbers. However, the device efficiency of the quaternary-sputtered CIGS is limited to 10%-11% due to the low and uncontrollable Se supply during the quaternary sputtering process. Here, an enhanced efficiency of 14.1% is reported by directly sputtering from a CIGS target without extra Se supply followed by sequential postdeposition treatments (PDT) of NaF and KF. The effects of different post-treatments of alkali metals on quaternary-sputtered CIGS thin films are discussed in detail. A Cu-depleted su...