2021
DOI: 10.1038/s41528-021-00116-w
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Direct roll transfer printed silicon nanoribbon arrays based high-performance flexible electronics

Abstract: Transfer printing of high mobility inorganic nanostructures, using an elastomeric transfer stamp, is a potential route for high-performance printed electronics. Using this method to transfer nanostructures with high yield, uniformity and excellent registration over large area remain a challenge. Herein, we present the ‘direct roll transfer’ as a single-step process, i.e., without using any elastomeric stamp, to print nanoribbons (NRs) on different substrates with excellent registration (retaining spacing, orie… Show more

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Cited by 57 publications
(48 citation statements)
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“…[ 13–19 ] Among the various flexible nanostructures, nanoribbons combine the long‐range charge transfer feature of 1D nanomaterials and large contact surface of 2D materials and hence, nanoribbons are suitable for flexible devices. [ 20,21 ]…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…[ 13–19 ] Among the various flexible nanostructures, nanoribbons combine the long‐range charge transfer feature of 1D nanomaterials and large contact surface of 2D materials and hence, nanoribbons are suitable for flexible devices. [ 20,21 ]…”
Section: Introductionmentioning
confidence: 99%
“…[13][14][15][16][17][18][19] Among the various flexible nanostructures, nano ribbons combine the longrange charge transfer feature of 1D nanomaterials and large contact surface of 2D materials and hence, nanoribbons are suitable for flex ible devices. [20,21] Metal phosphides are important semi conductors with various atomic structures and excellent photoelectronic proper ties. [22][23][24] Metal phosphides are used in many applications including light emis sion, infrared detection, and photoelec tron catalysis.…”
Section: Introductionmentioning
confidence: 99%
“…Amorphous SiO2 with high electrical resistivities also makes a suitable insulation layer [121]. Si3N4 and MgO are being used in microelectronics in the form of the gate dielectric in TFTs and transistors [121][122][123].…”
Section: Dielectricmentioning
confidence: 99%
“…The copper-etched fabrication of PCBs and conventional photolithography based approaches (or subtractive processes) are slowly being replaced by the additive manufacturing or printing electronic technologies so as to improve the resource efficiency. In this direction, innovative printing methods such as contact printing [132,133,136], transfer printing [129,137,138], and roll-based printing [123,139], screen printing [140][141][142], and inkjet printing etc. have been developed to realise inorganic nano to chip-scale devices, circuits and interconnects.…”
Section: E Sustainable Manufacturingmentioning
confidence: 99%
“…Alternatively, high‐performance and stable c‐Si microelectronic logic can be first fabricated upon silicon‐on‐insulator (SOI) substrates, then released and transferred, by etching the buried oxide layer, onto flexible polyimide (PI) thin film substrate, [ 25 , 26 , 27 ] as depicted schematically in Figure 1b . [ 28 , 29 ] Unfortunately, the high cost and small size of the SOI wafer substrates are still obstacles for establishing large area and low‐cost electronics, such as flexible displays and stretchable sensors and logic.…”
Section: Introductionmentioning
confidence: 99%