2012
DOI: 10.3390/ma5050985
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Direct Wafer Bonding and Its Application to Waveguide Optical Isolators

Abstract: This paper reviews the direct bonding technique focusing on the waveguide optical isolator application. A surface activated direct bonding technique is a powerful tool to realize a tight contact between dissimilar materials. This technique has the potential advantage that dissimilar materials are bonded at low temperature, which enables one to avoid the issue associated with the difference in thermal expansion. Using this technique, a magneto-optic garnet is successfully bonded on silicon, III-V compound semic… Show more

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Cited by 40 publications
(25 citation statements)
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“…A surface activated direct bonding technique is a powerful tool to realize a tight contact between dissimilar crystals [2426]. We developed a surface activated direct bonding technique for integrating a magneto-optical garnet on a silicon waveguide [14]. The surfaces of the target wafers are activated in a vacuum chamber.…”
Section: Magneto-optical Materialsmentioning
confidence: 99%
See 1 more Smart Citation
“…A surface activated direct bonding technique is a powerful tool to realize a tight contact between dissimilar crystals [2426]. We developed a surface activated direct bonding technique for integrating a magneto-optical garnet on a silicon waveguide [14]. The surfaces of the target wafers are activated in a vacuum chamber.…”
Section: Magneto-optical Materialsmentioning
confidence: 99%
“…However, it is very difficult to grow garnet crystals on the commonly used optical waveguide platforms such as silicon. We had previously developed a surface activated direct bonding technique to integrate a magneto-optical garnet on silicon and III–V compound semiconductors [13, 14]. Using this technique, a silicon waveguide optical isolator was fabricated for the first time with an optical isolation of 21 dB at a wavelength of 1559 nm [15].…”
Section: Introductionmentioning
confidence: 99%
“…Discrete isolators rely on Faraday rotation, i.e., a nonreciprocal mode conversion, but in PICs the use of nonreciprocal phase shift (NRPS) in a resonator or interferometer device is preferable to avoid problems caused by the birefringence of optical waveguides. The active material in these isolator devices is commonly a MO iron garnet material, in particular yttrium iron garnet (YIG, Y 3 Fe 5 O 12 ) with substituents such as Ce or Bi to increase the MO performance …”
Section: Introductionmentioning
confidence: 99%
“…A surface activated direct bonding technique is a powerful tool to realize a tight contact between dissimilar crystals [24][25][26]. We developed a surface activated direct bonding technique for integrating a magneto-optical garnet on a silicon waveguide [14]. The surfaces of the target wafers are activated in a vacuum chamber.…”
Section: Surface Activated Direct Bondingmentioning
confidence: 99%