Processing techniques are reviewed that allow the introduction of ceramic components made from powders into microelectromechanical systems (MEMS). Ceramics have several advantages over other materials also in microsystems, e.g., heat resistance, hardness, corrosion resistivity, or functional properties. The range of available materials in microfabrication technology is being increased beyond those deposited by thin‐film technology. Top–down approaches like mechanical and laser‐based direct writing processes, ink‐jet printing, microextrusion, and lithography‐based methods are presented. They are complemented by some more fundamental work in the field of bottom–up synthesis of micro‐ and nanoscaled ceramic materials.