1999
DOI: 10.1007/s11661-999-0053-5
|View full text |Cite
|
Sign up to set email alerts
|

Direction of grain-boundary migration in the weld metal of an austenitic stainless steel

Abstract: The moving direction of the grain boundary (GB), after solidification in the weld metal of AISI310S stainless steel, was examined through a computer simulation technique using the vertex dynamics model and by observing the microstructure. The results are as follows. (1) The grain-growth exponent in the vertex model was fitted to describe the experimental data. (2) The vertex dynamics model can predict the moving direction of a grain boundary in the weld metal after solidification.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2002
2002
2022
2022

Publication Types

Select...
3

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(2 citation statements)
references
References 10 publications
0
2
0
Order By: Relevance
“…10 More research works were concentrated upon the mathematical simulation for the grain growth and grain boundary migration around the fusion boundary. [11][12][13] Obviously, it is very important to realise the crystallographic orientation relationship between grains in HAZ and weld pool at the fusion boundary, which will help to further understand the failure mechanism of the welded joints and property variation between the base metal and weld metal.…”
Section: Introductionmentioning
confidence: 99%
“…10 More research works were concentrated upon the mathematical simulation for the grain growth and grain boundary migration around the fusion boundary. [11][12][13] Obviously, it is very important to realise the crystallographic orientation relationship between grains in HAZ and weld pool at the fusion boundary, which will help to further understand the failure mechanism of the welded joints and property variation between the base metal and weld metal.…”
Section: Introductionmentioning
confidence: 99%
“…Information on SGBM scattered in the literature since 1961 provides the following basic understanding: (i) SGBM occurs near the solidus temperature (T solidus ) of the alloy 9 , 21 , 22 , 25 , 33 ; (ii) the strain generated during cooling after solidification has a minor or negligible influence based on experiments using specially designed samples 20 − this clarifies an important concern about the underlying mechanism; (iii) tortuous or irregular SGBs are apt to migrate 20 , 34 , but SGBM is not due to grain growth 34 ; and (iv) the main driving force for SGBM is the reduction in the total GB energy 18 , 21 , 25 , 35 , and the GB triple junctions approach equilibrium (straight GBs in 120°–120°–120°) after SGBM 18 . However, compared to the GBM in recrystallisation or grain growth, the fundamental factors affecting SGBM, including alloy composition (solute type and content), cooling rate, solidification characteristics and grain size, remain essentially unexplored.…”
Section: Introductionmentioning
confidence: 99%