2012
DOI: 10.1007/s11661-012-1545-2
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Directional Solidification and Liquidus Projection of the Sn-Co-Cu System

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Cited by 13 publications
(2 citation statements)
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“…The Co 3 Sn 2 intermetallic compound (IMC) has been aroused researchers' attention in recent years [12][13][14][15]. It has an ordered hexagonal NiAs-type (P6 3 /mmc) crystal structure above 570 K and transforms into disorder orthorhombic Ni 3 Sn 2 -type (Pnma) structure at lower temperatures [16].…”
Section: Introductionmentioning
confidence: 99%
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“…The Co 3 Sn 2 intermetallic compound (IMC) has been aroused researchers' attention in recent years [12][13][14][15]. It has an ordered hexagonal NiAs-type (P6 3 /mmc) crystal structure above 570 K and transforms into disorder orthorhombic Ni 3 Sn 2 -type (Pnma) structure at lower temperatures [16].…”
Section: Introductionmentioning
confidence: 99%
“…It has an ordered hexagonal NiAs-type (P6 3 /mmc) crystal structure above 570 K and transforms into disorder orthorhombic Ni 3 Sn 2 -type (Pnma) structure at lower temperatures [16]. The melt undercooling and composition of the alloy are two significant factors that affect the formation of unusual dendrite growth morphology of Co 3 Sn 2 IMC [12][13][14]. Meanwhile, prior studies have shown that Co 3 Sn 2 intermetallic compound precipitates from the melt as the primary phase and displays a high volume fraction once Sn content exceeds 30 at% in the ternary (Co 0.5 Cu 0.5 ) (100−x) Sn x alloys during near-equilibrium solidification [15].…”
Section: Introductionmentioning
confidence: 99%