“…Jiang et al [ 18 , 19 , 20 ] employed DEM to model SiC ceramics, and explored the crack propagation and failure mode by simulating uniaxial compression and three-point bending tests. Zhang et al [ 21 ] modelled ultrasonic-assisted scratching of alumina ceramic using DEM, and found that the crack initiation was restricted by the addition of compressive stress on the target during the machining process. However, these studies did not consider the different grains in the ceramics, such as RB-SiC ceramic which is mainly made of bonded SiC and Si grains, and the propagation of cracks inside and along these grains, namely, the intergranular and transgranular fractures, during the machining process.…”