2020 IEEE High Performance Extreme Computing Conference (HPEC) 2020
DOI: 10.1109/hpec43674.2020.9286236
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Discrete Integrated Circuit Electronics (DICE)

Abstract: We introduce DICE (Discrete Integrated Circuit Electronics). Rather than separately develop chips, packages, boards, blades, and systems, DICE spans these scales in a direct-write process with the three-dimensional assembly of computational building blocks. We present DICE parts, discuss their assembly, programming, and design workflow, illustrate applications in machine learning and high performance computing, and project performance.

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Cited by 3 publications
(2 citation statements)
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“…16). Recent research shows that physical modularity is feasible [30] [31] [32] such as software modularity [33].…”
Section: P R O P O S I T I O N Smentioning
confidence: 99%

Guidelines for Robotics

Fiolet,
Topart,
Lahleb
et al. 2024
Preprint
“…16). Recent research shows that physical modularity is feasible [30] [31] [32] such as software modularity [33].…”
Section: P R O P O S I T I O N Smentioning
confidence: 99%

Guidelines for Robotics

Fiolet,
Topart,
Lahleb
et al. 2024
Preprint
“…On the scale of single-chip designs, a phase synchronizer is highly desirable to allow resilience against the significant timing uncertainty in crosschip connections [5]. On the scale of larger systems, unless synchronization recovery of data across unknown phases can be achieved, scaling to large multi-chip modules envisioned by system architects [12], [13] may be intractable.…”
Section: Introductionmentioning
confidence: 99%