Dislocation behavior in silicon crystal induced by laser shock peening: A multiscale simulation approach

Cheng, Gary J.; Shehadeh, Mutasem A.

doi:10.1016/j.scriptamat.2005.07.014

Cited by 34 publications

(18 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Absorbent layer prevents melting and laser ablation [3,6] while maintaining high surface quality [59] and without this layer, the energy conversion from pressure to shock cannot be made effectively [6]. This layer can be aluminum [53,60,61,62], copper [63], lead [4], vinyl tape [64,65,66], zinc [62] or black paint [6,11,54]. Hong et al [64] showed experimentally that black paint layer has the best absorption ability to laser; where almost 100% laser energy is absorbed by black paint as compared to 80% absorption by Al.…”

Section: Laser Shock Peeningmentioning

confidence: 99%

“…For most of the LSP studies, 355 nm [63,67,82,100,126,127,162], 532 nm [66,87,97,98,101,114] and 1064 nm [53,54,62,66,72,92,95] laser wavelengths have been used. The effect of wavelength on residual stress profile has not been meticulously studied; this could be due to its dependency on the laser type, power density [51,163] and the beam characteristics.…”

Section: Effect Of Laser Shock Peeningmentioning

confidence: 99%

See 1 more Smart Citation

Laser Peening Process and Its Impact on Materials Properties in Comparison with Shot Peening and Ultrasonic Impact Peening

2014

View full text Add to dashboard Cite

The laser shock peening (LSP) process using a Q-switched pulsed laser beam for surface modification has been reviewed. The development of the LSP technique and its numerous advantages over the conventional shot peening (SP) such as better surface finish, higher depths of residual stress and uniform distribution of intensity were discussed. Similar comparison with ultrasonic impact peening (UIP)/ultrasonic shot peening (USP) was incorporated, when possible. The generation of shock waves, processing parameters, and characterization of LSP treated specimens were described. Special attention was given to the influence of LSP process parameters on residual stress profiles, material properties and structures. Based on the studies so far, more fundamental understanding is still needed when selecting optimized LSP processing parameters and substrate conditions. A summary of the parametric studies of LSP on different materials has been presented. Furthermore, enhancements in the surface micro and nanohardness, elastic modulus, tensile yield strength and refinement of microstructure which translates to increased fatigue life, fretting fatigue life, stress corrosion cracking (SCC) and corrosion resistance were addressed. However, research gaps related to the inconsistencies in the literature were identified. Current status, developments and challenges of the LSP technique were discussed.

show abstract

Section: Laser Shock Peeningmentioning

confidence: 99%

Section: Effect Of Laser Shock Peeningmentioning

confidence: 99%

Laser Peening Process and Its Impact on Materials Properties in Comparison with Shot Peening and Ultrasonic Impact Peening

2014

View full text Add to dashboard Cite

show abstract

“…Дефекты упаковки имеют высокий энергетический барьер, поэтому дальнейшее распространение дислокационных плоскостей останавливается. Такое расположение устойчиво, как показано для лазерного упрочнения короткими импульсами в экспериментах на стали [50-52] и теоретически изучено в полупроводниках [53]. 995 В настоящем исследовании глубина воздействия лазерного импульса совпадает с глубиной эффективного лазерного энерговклада [26], которая для золота составляет около 50 нм для диапазона использованных плотностей энергии [47].…”

Section: сравнение результатов и обсуждениеunclassified

Analysis of periodic nanostructures formation on a gold surface under exposure to ultrashort laser pulses near the melting threshold

Сергеевич¹,

Петрович²,

Андреас³

et al. 2015

Naučno-teh. vestn. inf. tehnol. meh. opt.

View full text Add to dashboard Cite

Научно-технический вестник информационных технологий, механики и оптики, 2015, том 15, № 6 984 НАУЧНО-ТЕХНИЧЕСКИЙ ВЕСТНИК ИНФОРМАЦИОННЫХ ТЕХНОЛОГИЙ, МЕХАНИКИ И ОПТИКИ ноябрь-декабрь 2015 Том 15 № 6 a Университет ИТМО, Санкт-Петербург, 197101, Российская Федерация b Технический Университет Кайзерслаутерн и исследовательский центр ОПТИМАС, Кайзерслаутерн, 67653, Германия c Университет Касселя, Кассель, 34109, Германия d Лазерная лаборатория Гёттингена, Гёттинген, 37077, Германия e Институт физики материалов университета Гёттингена, Гёттинген, 37077, Германия Адрес для переписки: yak@lastech.ifmo.ru Информация о статье Поступила в редакцию 07.09.15, принята к печати 20.10.15

show abstract

“…The plasticity of single crystal silicon shocked by laser shock peening (LSP) is rarely studied except by Cheng, et al [9][10][11] . In the LSP experiments, they found single crystal silicon showes ductile behavior when the temperature reaches 850K and the applied laser power density is 6GW/cm 2 .…”

Section: Introductionmentioning

confidence: 99%

Deformation behavior of single crystal silicon induced by laser shock peening

Liu¹,

Wu²,

Wang³

et al. 2013

SPIE Proceedings

View full text Add to dashboard Cite

Laser shock peening can significantly improve the fatigue life of metals by introducing plastic deformation and compressive residual stresses near the surface. It has been widely applied on metals for surface strengthening. The plastic deformation behavior of brittle materials such as single crystal silicon under LSP is rarely studied. In the present research, the surface integrity and residual compressive stress of P-type single crystal silicon in <100> orientation shocked by LSP at imposed high temperature were measured to investigate the plastic deformation mechanism at high temperature and high compressive stress. The surface morphology of shocked silicon, observed using optical microscopy, showed that the cracks on the shocked silicon surface became less and the fragments were smaller while the temperature or the laser power density increased, which indicates that the plasticity of single crystal silicon is improved at high stress and temperature. However, the excessive laser power density would lead to local damage of the shocked silicon. The residual stress, measured using Raman scattering method, showed that the compressive residual stresses with magnitude of a few hundreds of MPa were introduced in the surface layer of silicon after LSP at imposed high temperature, and it increased with respect to the temperature and the laser power density. The experimental result indicates the material has experienced the plastic deformation and provides a potential processing method to improve the mechanical behavior of brittle material like single crystal silicon.

show abstract

Dislocation behavior in silicon crystal induced by laser shock peening: A multiscale simulation approach

Cited by 34 publications

References 14 publications

Laser Peening Process and Its Impact on Materials Properties in Comparison with Shot Peening and Ultrasonic Impact Peening

Laser Peening Process and Its Impact on Materials Properties in Comparison with Shot Peening and Ultrasonic Impact Peening

Analysis of periodic nanostructures formation on a gold surface under exposure to ultrashort laser pulses near the melting threshold

Deformation behavior of single crystal silicon induced by laser shock peening

Contact Info

Product

Resources

About