Dislocation Evolution in Cyclic‐Loaded Cu Nanopillars with Different Configurations

Abstract

Small‐sized metals generally exhibit unusual deformation responses subjected to cyclic loading, since their limited volume cannot effectively accommodate micro‐sized dislocation patterns typically found in their bulk counterparts. Here, the cyclic behaviors in Cu nanopillars with different configurations are investigated using in situ transmission electron microscopy fatigue test. Dislocation tangles formed in single‐ and twinned‐crystal nanopillars as a result of cycling‐induced operations of multiple slip systems and further unpinning and absorption of pinned dislocations. While, nanopillars configured with low‐angle grain boundary (LAGB) underwent the degradation and eventual decomposition of the LAGB due to the cycling‐induced emission of grain boundary dislocations, which resulted in high‐density mobile dislocations to withstand the cyclic loading. These findings contribute to a systematic and comprehensive understanding of the micro‐mechanics of dislocation‐related phenomena in the cyclic response of nanoscale metals.