“…The high-temperature post-growth annealing of heterostructures is useful for the engineering of semiconductor devices because it allows band-gap structure modification [ 1 , 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 ] and an oscillator strength [ 10 , 11 ], controls hyperfine interaction [ 12 ], adjusts the dephasing time of excitons [ 13 ], and reduces strain gradients [ 14 , 15 , 16 , 17 , 18 , 19 ]. For III-V semiconductor heterostructures, the changes occurring at the annealing are based on the intermixing that proceeds via the vacancy-mediated mechanism in which the atom jumps into a vacancy induced by high-temperature heating at a neighboring lattice site [ 2 , 3 , 20 , 21 ].…”