Dispense Printing of Silver Flake Inks on Hydrophilic and Hydrophobic Surfaces

Abstract

In printed electronics, achieving precise deposition of conductive materials on challenging substrates like Teflon is critical. This study delves into dispense printing, a technique that offers precision and versatility for creating electronic patterns. The deposition of high‐viscosity silver flake inks on both hydrophobic surfaces is investigated, such as Teflon, and hydrophilic ones, highlighting the significant interplay between ink viscosity and substrate wettability. This interaction is key to controlling ink spreading, drying behavior, and, ultimately, printing success. Research explores the relationships between critical parameters such as nozzle height, dispense pressure, and print speed, aiming to enhance the quality and functionality of printed electronics. The printing process is analyzed through its distinct phases: extrusion from the nozzle, spreading on the substrate, and line shrinking during drying. This methodological approach allows one to pinpoint how each parameter specifically influences the printing outcome, particularly on challenging substrates like Teflon. By advancing the understanding of these dynamics, the study offers valuable theoretical insights and practical advancements for fabricating high‐quality, flexible electronics across diverse substrates. The findings underscore dispense printing's potential to meet the growing demand for flexible electronics.