Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) 2003
DOI: 10.1109/epep.2003.1250011
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Dispersion and resonance of on-chip interconnect lines with underlayer orthogonal metal grids

Abstract: Abstrucf: High-speed interconnect lines with underlayer orthogonal metal grids show significant decreases in dispersions and signal transmission velocities below -10GHz. Strong resonance occurs at higher frequencies, which can be accurately predicated by the patch antenna theory.

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