Dissolution Rate of Electronics Packaging Surface Finish Elements in Sn3.0Ag0.5Cu Solder

Intense Pulsed Light Soldering of Sn–3.0Ag–0.5Cu Ball Grid Array Component on Au/Pd(P)/Ni(P) Surface‐Finished Printed Circuit Board and Its Drop Impact Reliability

“…As shown in Figure 4a,d Generally, the topmost Au and Pd layers dissolve quickly in the molten solder. [27] Several studies have reported the chronological reactions of Pd atoms. [21,23,28] Kim et al reported that Au reacts with Sn in the molten solder and transforms into AuSn 4 within 15 s, when the reflow of the SAC305 solder was conducted at 260 °C using a hot plate.…”

“…Several studies have reported that Au and Pd deteriorated the mechanical properties of solder joints, the so‐called Au (or Pd) embrittlement. [ 21,27,35,36 ] Kim et al reported that the (Pd,Ni)Sn 4 /(Cu,Ni) 6 Sn 5 interface is weak; therefore, cracks propagate along the interface during the high‐speed ball shear test. [ 21 ] Additionally, Ho et al reported that the mechanical strength of solder joints remarkably decreases when PdSn 4 aggregates at the interface.…”