Distribution of copper, silver and gold during thermal treatment with brominated flame retardants

Oleszek, Sylwia; Grabda, Mariusz Grzegorz; Shibata, Etsuro; Nakamura, Takashi

doi:10.1016/j.wasman.2013.05.009

Cited by 27 publications

(23 citation statements)

References 18 publications

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“…The most commonly used BFR is tetrabromobisphenol A (TBBPA) [60]. It is used in over 70% of all electronic and electrical equipment worldwide [61]. The rapid decomposing of TBBPA during thermal processing has been well characterised [59,62,63].…”

Section: Smeltingmentioning

confidence: 99%

A Comparison of Methods for the Characterisation of Waste-Printed Circuit Boards

Yken

Cheng

Boxall

et al. 2021

Metals

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Electronic waste is a growing waste stream globally. With 54.6 million tons generated in 2019 worldwide and with an estimated value of USD 57 billion, it is often referred to as an urban mine. Printed circuit boards (PCBs) are a major component of electronic waste and are increasingly considered as a secondary resource for value recovery due to their high precious and base metals content. PCBs are highly heterogeneous and can vary significantly in composition depending on the original function. Currently, there are no standard methods for the characterisation of PCBs that could provide information relevant to value recovery operations. In this study, two pre-treatments, smelting and ashing of PCB samples, were investigated to determine the effect on PCB characterisation. In addition, to determine the effect of particle size and element-specific effects on the characterisation of PCBs, samples were processed using four different analytical methods. These included multi-acid digestion followed by inductively coupled plasma optical emission spectrometry (ICP-OES) analysis, nitric acid digestion followed by X-ray fluorescence (XRF) analysis, multi-acid digestion followed by fusion digestion and analysis using ICP-OES, and microwave-assisted multi-acid digestion followed by ICP-OES analysis. In addition, a mixed-metal standard was created to serve as a reference material to determine the accuracy of the various analytical methods. Smelting and ashing were examined as potential pre-treatments before analytical characterisation. Smelting was found to reduce the accuracy of further analysis due to the volatilisation of some metal species at high temperatures. Ashing was found to be a viable pre-treatment. Of the four analytical methods, microwave-assisted multi-acid digestion offered the most precision and accuracy. It was found that the selection of analytical methods can significantly affect the accuracy of the observed metal content of PCBs, highlighting the need for a standardised method and the use of certified reference material.

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Section: Smeltingmentioning

confidence: 99%

A Comparison of Methods for the Characterisation of Waste-Printed Circuit Boards

Yken

Cheng

Boxall

et al. 2021

Metals

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“…The principal decomposition component in the thermolysis and pyrolysis of TBBPA is HBr [8] [14]; however, many organic compounds such as phenols and bromophenols are also formed [14]- [20]. The formation pathways [21] of polybrominated dibenzo-p-dioxins and dibenzofurans are still being studied.…”

Section: Introductionmentioning

confidence: 99%

“…Basic information regarding the bromination reaction of metals is needed to increase the rate of metal recovery from waste circuit boards and prevent unintentional loss, and studies have been conducted using thermodynamic calculations [26]. Experimental quantitative analysis regarding the bromination behaviour of Zn has been conducted through thermal testing of samples containing ZnO and TBBPA [27] [32], Cu [8], Ag [8], Au [8], and electric arc furnace dust [33].…”

Section: Introductionmentioning

confidence: 99%

Bromination of Pd Compounds during Thermal Decomposition of Tetrabromobisphenol A

Kuzuhara¹,

Sano²

2018

ENG

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We conducted thermal tests using the reagent tetrabromobisphenol A (TBBPA) and various Pd compounds to study the chemical forms of Pd obtained during the pyrolytic and oxidative decomposition of TBBPA. Thermal testing was conducted in an electric furnace at temperatures of 280˚C -800˚C in an Ar or Ar-O 2 (5%) atmosphere for a heating period of 40 min. Scanning electron microscopy-energy dispersive X-ray spectroscopy results revealed that Pd bromide was formed in the mixture of TBBPA and PdO after heating to 450˚C in the Ar atmosphere. In addition, thermogravimetry-differential thermal analysis showed that as the heating temperature was increased from 350˚C to 730˚C, weight loss occurred at a nearly constant rate, indicating that Pd bromide decomposed in this temperature range.

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“…are the most exercised pyrometallurgical WPCBs recycling technique (Flandinet et al, 2012;Guo et al, 2010;Rath et al, 2012). The exorbitant environmental impacts arising due to lethal emissions, loss of metal in vapor and complex compounds formation stringently limits the applicability of different thermal process (Bhaskar et al, 2008;Oleszek et al, 2013;Xie et al, 2009).…”

Section: Introductionmentioning

confidence: 99%

Comparative study of printed circuit board recycling by cracking of internal layers using organic solvents-dimethylformamide and dimethylacetamide

Verma

Singh

Mankhand

2017

Journal of Cleaner Production

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Distribution of copper, silver and gold during thermal treatment with brominated flame retardants

Cited by 27 publications

References 18 publications

A Comparison of Methods for the Characterisation of Waste-Printed Circuit Boards

A Comparison of Methods for the Characterisation of Waste-Printed Circuit Boards

Bromination of Pd Compounds during Thermal Decomposition of Tetrabromobisphenol A

Comparative study of printed circuit board recycling by cracking of internal layers using organic solvents-dimethylformamide and dimethylacetamide

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