Does current crowding induce vacancy concentration singularity in electromigration?

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

2023

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This paper investigates thermomigration (TM) and electromigration (EM) in SWEAT structure. Firstly, the distribution of temperature along SWEAT structure during EM is obtained by using finite element (FE) simulation. The FE simulation results show that the temperature is almost uniformly distributed in the most region of narrow line in SWEAT structure, but temperature decreases rapidly at both sides of conductor. Accordingly, the temperature gradient in the narrow line of SWEAT structures is calculated. Then, we apply the obtained temperature and temperature gradient in the governing equation of EM in terms of atomic concentration. The numerical results show that the TM caused by temperature gradient causes the material depletion near both ends of conductor. At the same time, atoms diffuse from the middle region of conductor to both sides driven by the atomic concentration, causing the voids in middle of conductor.

Section: Introductionmentioning

confidence: 99%

Effect of Thermomigration on Electromigration in SWEAT Structures

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

2023

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“…We have used different software such as ANSYS and COMSOL, and different numerical approaches, such as peridynamics and finite element method to obtain the numerical solutions. [22][23][24][25] In this paper, EM in the passivated conductor is further studied on the basis of the coupling theory. The passivation layer is considered as an elastic material, not the rigid layer anymore.…”

Section: Introductionmentioning

confidence: 99%

Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

2023

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In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the passivation layer. One-dimensional (1D) analytical solution for the passivated conductor is obtained. The numerical results show that the conductor covered with the stiffer passivation layer has much less EM damage. And the steady-state solution shows that the magnitude of (jL)c increases with increasing Young's modulus of passivation material. The present study provides a way to predict the EM performances taking into account various passivation materials.

“…As such, it has been a focus of intense experimental study and numerical simulation [11]. Based on the accurate numerical modeling method, the prediction of time-to-failure (TTF) of interconnects under high current density can complement experiments to optimize the interconnect structure and improve its reliability [12][13][14][15]. Over the past decades, there are many research works on the formulation and solution of electromigration.…”

Section: Introductionmentioning

confidence: 99%

“…The GCM has been implemented in ANSYS published in refer. [24][25][26][27][28]. In the GCM model, the diffusion equation (mass conservation equation) is not a standard form of the diffusion equation in the built-in multiphysics theory in ANSYS.…”

Section: Introductionmentioning

confidence: 99%

Implementation of Fully Coupled Electromigration Theory in COMSOL

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

2022

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In this paper, a 3D and fully coupled electromigration modeling is implemented using COMSOL. The fully coupled multi-physics theory has a unique set of partial differential equations, which cannot be directly simulated with the standard finite element software such as ABAQUS and ANSYS. With the weak form PDE modulus in COMSOL, the weak form of the governing equations is obtained and realized for a 3D finite element modeling of electromigration. The metal lines under totally constrained and stress-free conditions with a perfectly blocking condition are presented as benchmark problems, in which the finite element solutions are in excellent agreement with the analytical solutions.