Dominant mechanisms of the sintering of copper nano-powders depending on the crystal misalignment

Seong, Yujin; Kim, Youngkyu; German, Randall M.; Kim, Sungho; Kim, Seong‐Gon; Kim, See Jo; Kim, Soo Hyun; Park, Seong Jin

doi:10.1016/j.commatsci.2016.06.016

Cited by 20 publications

(18 citation statements)

References 32 publications

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“…Greater dislocation generation generally increases neck growth by increasing atomic diffusion from the volume of the nanostructures 48 and by increasing the sintering stresses. 49 Since solely surface diffusion cannot explain the x/r trends, grain boundary diffusion is much smaller than surface diffusion, and dislocation generation trends are similar to the x/r trends, we conclude that dislocation-induced mass transfer is the dominant mechanism causing the observed interface-specific changes in x/r.…”

Section: Acs Applied Materials and Interfacesmentioning

confidence: 99%

Shape-Tuned Junction Resistivity and Self-Damping Dynamics in Intense Pulsed Light Sintering of Silver Nanostructure Films

Hwang

Malhotra

2018

ACS Appl. Mater. Interfaces

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Concurrently reducing processing temperature, electrical resistance, and material cost with scalable fabrication capabilities is critical for conductive elements of flexible and planar electronics. Intense pulsed light sintering (IPL) of mixed dissimilar-shape conductive nanostructures may achieve this goal. However, this potential is hindered by knowledge gaps on how dissimilarity in nanostructure shape affects interparticle neck growth kinetics in general and the self-damping coupling between neck growth and optical absorption in IPL. We study these phenomena for IPL of mixed Ag nanowires (NWs, 40 nm diameter, 100–200 μm length) and nanospheres (NSs, 40 nm diameter), both experimentally and by linking molecular dynamics simulations with optical modeling. An optimal 50:50 mixing ratio lowers resistivity (5.59 μΩ·cm) and peak temperatures (250–150 °C) relative to pure NS films and reduces material costs relative to pure NW films with similar resistivity, in 2.5 s of IPL. The drop in peak temperatures in consecutive optical pulses reduces with greater NW content. Sintering-induced dislocation generation drives higher neck growth at NW–NS and NW–NW interfaces and anisotropic neck growth at NW–NS interfaces. This indicates that when NWs are introduced into NS films, along with lesser number of interfacial contact points, an inherent reduction in sintering-induced junction resistivity plays a major role in reducing film resistivity. The self-damping coupling and optical absorption, which drive temperature evolution in IPL, are tunable by nanostructure shape. The introduction of NWs into a NS ensemble reduces the dependence of optical absorption on neck growth. We discuss how these insights elucidate a set of physical phenomena that can guide the choice of dissimilar shaped nanostructures to concurrently reduce resistivity and temperatures in IPL and other sintering processes.

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Section: Acs Applied Materials and Interfacesmentioning

confidence: 99%

Shape-Tuned Junction Resistivity and Self-Damping Dynamics in Intense Pulsed Light Sintering of Silver Nanostructure Films

Hwang

Malhotra

2018

ACS Appl. Mater. Interfaces

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“…In the sintering process, no segregation or melting of low-melting-point metals occurs first, so it is widely used in the powder metallurgy industry [28][29][30]. In addition to temperature, powder size is one of the parameters affecting sintering conditions in conventional sintering [31][32][33][34]. To verify whether diameters of the powders will affect the performance of the microstructures, two pre-alloyed powders with different diameters were selected.…”

Section: Resultsmentioning

confidence: 99%

Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure

Huang

Sun

et al. 2020

Micromachines

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In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated, and the effects of powder types were compared. The parameters influencing the properties and processing speed were analyzed. The results showed that the pre-alloyed powder exhibited the best uniformity and stability when the experiment used two or more types of powders to avoid the segregation effect. The smaller the particle diameter, the better the inductive performance will be. The entire structure can be sintered near the melting point of the alloy, and increasing the temperature increases strength, while resulting in low resistivity. Finally, an 800-µm-high coil was fabricated. This process does not need surface metallization and seed layer formation. The forming process involves only sintering instead of slowly growing copper with a tiny current. Therefore, this process has advantages, such as a process time of 7 h, corresponding to an 84% reduction compared to current electroplating processes (45 h), and a 543% efficiency improvement. Thus, this process is more efficient, controllable, stable, and suitable for mass production of devices with flexible dimensions.

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“…In a similar example [12], dominating mechanisms of sintering have been investigated using molecular 05042-4 dynamics simulations based on the embedded-atom method for copper nanoparticles. One of the main results in [12] is that the particle rotation during sintering is mainly induced by grain boundary torque with grain boundary diffusion and rarely by dislocation. This coincides with the result obtained in our simulations by Monte-Carlo method.…”

Section: Resultsmentioning

confidence: 99%

Estimation of the Dihedral Angle Between Metal Nanoparticles During Their Coalescence

Kolosov¹,

Sokolov²,

Sdobnyakov³

et al. 2017

J. Nano- Electron. Phys.

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Dominant mechanisms of the sintering of copper nano-powders depending on the crystal misalignment

Cited by 20 publications

References 32 publications

Shape-Tuned Junction Resistivity and Self-Damping Dynamics in Intense Pulsed Light Sintering of Silver Nanostructure Films

Shape-Tuned Junction Resistivity and Self-Damping Dynamics in Intense Pulsed Light Sintering of Silver Nanostructure Films

Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure

Estimation of the Dihedral Angle Between Metal Nanoparticles During Their Coalescence

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