Donut-like MOFs of copper/nicotinic acid and composite hydrogels with superior bioactivity for rh-bFGF delivering and skin wound healing

Abstract

Background Skin injury and the resultant defects are common clinical problems, and usually lead to chronic skin ulcers and even life-threatening diseases. Copper, an essential trace element of human body, has been reported to promote the regeneration of skin by stimulating proliferation of endothelial cell and enhance angiogenesis. Results Herein, we have prepared a new donut-like metal–organic frameworks (MOF) of copper-nicotinic acid (CuNA) by a simple solvothermal reaction. The rough surface of CuNA is beneficial for loading/release basic fibroblast growth factor (bFGF). The CuNAs with/without bFGF are easily processed into a light-responsive composite hydrogel with GelMA, which not only show excellent mechanical properties, but also display superior biocompatibility, antibacterial ability and bioactivity. Moreover, in the in vivo full-thickness defect model of skin wound, the resultant CuNA-bFGF@GelMA hydrogels significantly accelerate the wound healing, by simultaneously inhibiting the inflammatory response, promoting the new blood vessels formation and the deposition of collagen and elastic fibers. Conclusions Considering the superior biocompatibility, antibacterial ability and bioactivity, the CuNA and its composite light-responsive hydrogel system will be promising in the applications of skin and even other tissue regeneration. Graphic abstract

Development of tannin-bridged cerium oxide microcubes-chitosan cryogel as a multifunctional wound dressing

“…Swelling is an essential property of cryogels, enabled the cryogels to absorb excessive exudate of the wound, and provide a moist environment bene cial to wound healing [40][41][42]. Also, the porous structure is conducive to cell migration and provides excellent oxygen permeability, which could accelerate wound healing [43,44].…”

“…Overdose in ammatory response may lead to further tissue damage and delayed wound healing [41]. Therefore, the two typical in ammatory factors, including TNF-𝛼 (pro-in ammatory) and IL-10 (antiin ammatory), were estimated via immunohistochemistry staining and RT-PCR, to study the effect of CS-TA@CeO 2 cryogels in extenuating the in ammation during wound healing.…”

Metal-based nano-delivery platform for treating bone disease and regeneration

“…In recent years, nano Cu MOFs have been frequently explored in the field of tissue engineering and nano-drug loading ( Telgerd et al, 2019 ; Wang T.-L. et al, 2021 ; Binaeian et al, 2022 ). Benzene-1,3,5tricarboxylate linkers and Cu ions are connected to form Hong Kong University of Science and Technology-1 (HKUST-1), which is a widely used nano-Cu MOF ( Lin et al, 2012 ).…”

Application of Metal–Organic Framework in Diagnosis and Treatment of Diabetes

“…To accelerate skin regeneration, Wang et al used the natural biomolecules of niacin (NA) as organic ligands for the first time to prepare a novel copper-based MOF material (CuNA) with a ring structure for loading and releasing bFGF, which significantly promoted cell proliferation and angiogenesis [ 201 ]. As one of the essential metal elements in the human body, the improved effect of copper-based MOFs on diabetic wound healing has been demonstrated in previous reports [ 201 , 202 , 203 ].…”

“…To accelerate skin regeneration, Wang et al used the natural biomolecules of niacin (NA) as organic ligands for the first time to prepare a novel copper-based MOF material (CuNA) with a ring structure for loading and releasing bFGF, which significantly promoted cell proliferation and angiogenesis [ 201 ]. As one of the essential metal elements in the human body, the improved effect of copper-based MOFs on diabetic wound healing has been demonstrated in previous reports [ 201 , 202 , 203 ]. Copper promotes the release of vascular endothelial growth factors (VEGFs) and cytokines by coordinating the expression of hypoxia-inducible factor-1a (HIF-1a) and proline hydroxylase, triggering endothelial cell angiogenesis [ 204 , 205 ].…”