Proceedings of the 46th Annual Design Automation Conference 2009
DOI: 10.1145/1629911.1629930
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Double patterning lithography friendly detailed routing with redundant via consideration

Abstract: In double patterning lithography (DPL), coloring conflict and stitch minimization are the two main challenges. Post layout decomposition algorithm [1] [2]may not be enough to achieve high quality solution for DPL-unfriendly designs, due to complex 2D patterns in lower metal layers. Therefore, DPL-friendliness is needed at routing stage [3]. Another key yield improvement technique is redundant via insertion [4] [5]. However, this would increase the complexity in DPL-compliance. To make designs manufacturable in… Show more

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Cited by 25 publications
(8 citation statements)
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“…A lot of work focused on developing multiple patterningaware routers, like LELE-aware routing, [20][21][22] triple patterning-aware routing, 23 SADP-, and SAQP-aware routing. 24,25 However, none of these works offered a pattern-centric design rule evaluation method, and this is the main contribution of our work.…”
Section: Prior Workmentioning
confidence: 99%
“…A lot of work focused on developing multiple patterningaware routers, like LELE-aware routing, [20][21][22] triple patterning-aware routing, 23 SADP-, and SAQP-aware routing. 24,25 However, none of these works offered a pattern-centric design rule evaluation method, and this is the main contribution of our work.…”
Section: Prior Workmentioning
confidence: 99%
“…Therefore, Cho et al [14] proposed the first DPT -aware detailed routing algorithm which simultaneously finds a DPT -friendly routing path and corresponding layout decomposition for each net; as a result, they perform LD in the routing stage and apply rerouting to reduce conflict. Afterward, Yuan et al [40] proposed DPT friendly detailed routing, which considers not only LD but also redundant vias in the detailed routing.…”
Section: Double-patterning Technologymentioning
confidence: 99%
“…The first detailed routing algorithms that have been proposed for multiple patterning technologies [3], [4], [5], [6] have been targeted at the LELE ("litho-etch-litho-etch") double patterning technology, where objects on each layer are assigned to two different masks that are also referred to as colors. These approaches have in common that they assume the availability of stitching and jogs, which is not always realistic.…”
Section: Introductionmentioning
confidence: 99%