Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Li, Wenyu; Chen, Wei; Jiang, Jing; Tang, Hongyu; Zhang, Guoqi; Fan, Jiajie

doi:10.1016/j.csite.2023.103763

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Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Cited by 2 publications

References 28 publications

Thermal-induced warpage characterization for laminated packaging with three-dimensional thermoelasticity modeling and projection moiré measurement

Thermal-induced warpage characterization for laminated packaging with three-dimensional thermoelasticity modeling and projection moiré measurement

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

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