2023
DOI: 10.1108/mi-07-2022-0139
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Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication

Abstract: Purpose A large-scale detection system with more data in short time bins, small dead space and small signal identification is the ideology the scientists pursuing. These proposed demands are able to be solved by 2.5 D integration. The substance of a 2.5 D integration is called silicon interposer, which consists of the through silicon via (TSV) and redistribution layer. However, the state-of-the-art silicon interposer is not able to sustain its own mechanical strength with the detector/readout array often sitti… Show more

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