Dramatic enhancement of interfacial thermal transport by mass-graded and coupling-graded materials

Xiong, Guohuan; Wang, Jian‐Sheng; Ma, Dengke

doi:10.1209/0295-5075/128/54007

Cited by 18 publications

(18 citation statements)

References 39 publications

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“…Here, the mass interval is set as 0.15×10 -26 kg. and 8, the mass distribution with the maximum ITC is close to a nonlinear distribution, which is neither linear nor exponential distribution predicted by previous work [19,24,25] , is similar to a sinusoidal curve around linear distribution for larger thickness interlayer. In addition, the intersection point between mass distribution with maximum ITC and linear distribution is closer to the contact that has large value of atom mass.…”

Section: Resultscontrasting

confidence: 63%

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Maximization and minimization of interfacial thermal conductance by modulating the mass distribution of the interlayer

Yang

Xiao

et al. 2021

Phys. Rev. B

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Tuning interfacial thermal conductance has been a key task for the thermal management of nanoelectronic devices. Here, it is studied how the interfacial thermal conductance is great influenced by modulating the mass distribution of the interlayer of one-dimensional atomic chain.By nonequilibrium Green's function and machine learning algorithm, the maximum/minimum value of thermal conductance and its corresponding mass distribution are calculated. Interestingly, the mass distribution corresponding to the maximum thermal conductance is not a simple function, such as linear and exponential distribution predicted in previous works, it is similar to a sinusoidal curve around linear distribution for larger thickness interlayer. Further, the mechanism of the abnormal results is explained by analyzing the phonon transmission spectra and density of states.The work provides deep insight into optimizing and designing interfacial thermal conductance by modulating mass distribution of interlayer atoms.

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Section: Resultscontrasting

confidence: 63%

“…Moreover, they found that the exponential mass distribution has better performance than the linear mass distribution in enhancing the ITC. Later, Xiong et al found that the ITC of 1D atomic junction with interlayer of both geometric graded mass and geometric graded coupling can be enhanced nearly up to 6-fold by NEGF method [25] .…”

Section: Introductionmentioning

confidence: 99%

Maximization and minimization of interfacial thermal conductance by modulating the mass distribution of the interlayer

Yang

Xiao

et al. 2021

Phys. Rev. B

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“…For the couplers with both geometric graded mass and geometric graded coupling, the interfacial thermal conductance can be maximum enhanced nearly up to sixfold compared to the optimized homogenous case. They also found that the interfacial thermal conductance decreases with the increasing cutoff frequency ratios for all six cases due to the increasing mismatch of the cutoff frequency 53 .…”

Section: Electron-phonon Interactionmentioning

confidence: 89%

“…For the two-junction model with homogenous mass and coupling in the central part, it is found that the phonon transmission oscillates with frequency in the envelope lines of minimum and maximum transmission which can be determined by the single-junction model 51 . The interfacial thermal conductance of two-junction model for various mass-graded and coupling-graded materials was investigated by Xiong et al 53 The optimized homogenous coupler 54 , the arithmetic mass-graded and couplinggraded coupler, the geometric mass-graded and couplinggraded coupler, and the coupler with both geometric graded mass and coupling were studied. Relative to the optimized homogenous couplers, the mass-graded or coupling-graded structures were found to be applicable to improve the interfacial thermal conductance of two lead materials with both mismatched impedance and mismatched cutoff frequencies 53 .…”

Section: Electron-phonon Interactionmentioning

confidence: 99%

“…The interfacial thermal conductance of two-junction model for various mass-graded and coupling-graded materials was investigated by Xiong et al 53 The optimized homogenous coupler 54 , the arithmetic mass-graded and couplinggraded coupler, the geometric mass-graded and couplinggraded coupler, and the coupler with both geometric graded mass and coupling were studied. Relative to the optimized homogenous couplers, the mass-graded or coupling-graded structures were found to be applicable to improve the interfacial thermal conductance of two lead materials with both mismatched impedance and mismatched cutoff frequencies 53 . For the couplers with both geometric graded mass and geometric graded coupling, the interfacial thermal conductance can be maximum enhanced nearly up to sixfold compared to the optimized homogenous case.…”

Section: Electron-phonon Interactionmentioning

confidence: 99%

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A brief review of thermal transport in mesoscopic systems from nonequilibrium Green's function approach

Xiong

2021

Preprint

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With the rapidly increasing integration density and power density in nanoscale electronic devices, the thermal management concerning heat generation and energy harvesting becomes quite crucial. Since phonon is the major heat carrier in semiconductors, thermal transport due to phonons in mesoscopic systems has attracted much attention. In quantum transport studies, the nonequilibrium Green's function (NEGF) method is a versatile and powerful tool that has been developed for several decades. In this review, we will discuss theoretical investigations of thermal transport using the NEGF approach from two aspects. For the aspect of phonon transport, the phonon NEGF method is briefly introduced and its applications on thermal transport in mesoscopic systems including onedimensional atomic chains, multi-terminal systems, and transient phonon transport are discussed. For the aspect of thermoelectric transport, the caloritronic effects in which the charge, spin, and valley degrees of freedom are manipulated by the temperature gradient are discussed. The timedependent thermoelectric behavior is also presented in the transient regime within the partitioned scheme based on the NEGF method.

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Thermal interface materials: From fundamental research to applications

Wei,

Luo,

et al. 2024

SusMat

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The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering problem—a heat death problem called in semiconductor industry. A comprehensive examination of interfacial thermal resistance has been given from physics perspective in 2022 in Review of Modern Physics. Here, we provide a detailed overview from a materials perspective, focusing on the optimization of structure and compositions of thermal interface materials (TIMs) and the interact/contact with heat source and heat sink. First, we discuss the impact of thermal conductivity, bond line thickness, and contact resistance on the thermal resistance of TIMs. Second, it is pointed out that there are two major routes to improve heat transfer through the interface. One is to reduce the TIM's thermal resistance (RTIM) of the TIMs through strategies like incorporating thermal conductive fillers, enhancing interfacial structure and treatment techniques. The other is to reduce the contact thermal resistance (Rc) by improving effective interface contact, strengthening bonding, and utilizing mass gradient TIMs to alleviate vibrational mismatch between TIM and heat source/sink. Finally, such challenges as the fundamental theories, potential developments in sustainable TIMs, and the application of AI in TIMs design are also explored.

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Dramatic enhancement of interfacial thermal transport by mass-graded and coupling-graded materials

Cited by 18 publications

References 39 publications

Maximization and minimization of interfacial thermal conductance by modulating the mass distribution of the interlayer

Maximization and minimization of interfacial thermal conductance by modulating the mass distribution of the interlayer

A brief review of thermal transport in mesoscopic systems from nonequilibrium Green's function approach

Thermal interface materials: From fundamental research to applications

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