Optical and EUV Nanolithography XXXVII 2024
DOI: 10.1117/12.3009961
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Driving exposure accuracy and cost-of-ownership on DUV immersion and dry-NXT scanner products

Wim P. de Boeij,
Bart Smeets,
Massimo Viola
et al.

Abstract: In this paper we will report on the most recent immersion scanner innovations to improve scanner matching overlay. These are realized by improvements in e.g. optical column distortion, wafer alignment and system-metrology. We will elaborate on scanner solutions for wafer handling/chucking of warped wafers. Furthermore, to enable cost-of-ownership reduction, system design implementations driving larger scanner productivity (wafer per hour) will be presented.

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